Topic-Beganovic; Zeljka
Patent Applications and Registrations
Patent applications and USPTO patent grants for Topic-Beganovic; Zeljka.The latest application filed is for "wafer frontside-backside through silicon via".
- Topic-Beganovic; Zeljka - Essex Junction VT
| Patent | Date |
|---|---|
| Wafer frontside-backside through silicon via Grant 9,455,214 - Maling , et al. September 27, 2 | 2016-09-27 |
| Method of eliminating poor reveal of through silicon vias Grant 9,443,764 - Maling , et al. September 13, 2 | 2016-09-13 |
| Wafer Frontside-backside Through Silicon Via App 20150332966 - MALING; Jeffrey C. ; et al. | 2015-11-19 |
| Automated residual material detection Grant 9,043,743 - Maling , et al. May 26, 2 | 2015-05-26 |
| Automated Residual Material Detection App 20150113494 - MALING; Jeffrey C. ; et al. | 2015-04-23 |
| Eliminating Poor Reveal Of Through Silicon Vias App 20150101856 - Maling; Jeffrey C. ; et al. | 2015-04-16 |
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