Toong; Teik Tiong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Toong; Teik Tiong.The latest application filed is for "integrated device package".
- Toong; Teik Tiong - Tanjung Tokong MY
- Toong; Teik Tiong - Simpang Ampat MY
- Toong; Teik Tiong - Siam N/A MY
- Toong; Teik Tiong - Penang N/A MY
| Patent | Date |
|---|---|
| Integrated device package Grant 11,189,593 - Toong , et al. November 30, 2 | 2021-11-30 |
| Integrated device package Grant 11,083,089 - Toong , et al. August 3, 2 | 2021-08-03 |
| Integrated Device Package App 20210082862 - Toong; Teik Tiong ; et al. | 2021-03-18 |
| Stacked leadframe packages Grant 9,601,419 - Toong , et al. March 21, 2 | 2017-03-21 |
| Package having spaced apart heat sink Grant 9,054,077 - Lim , et al. June 9, 2 | 2015-06-09 |
| Systems including an I/O stack and methods for fabricating such systems Grant 8,786,080 - Lim , et al. July 22, 2 | 2014-07-22 |
| Thermoset molding for on-package decoupling in flip chips Grant 8,541,263 - Toong , et al. September 24, 2 | 2013-09-24 |
| IC package with capacitors disposed on an interposal layer Grant 8,525,326 - Toong , et al. September 3, 2 | 2013-09-03 |
| Systems Including An I/o Stack And Methods For Fabricating Such Systems App 20120228760 - Lim; Chooi Pei ; et al. | 2012-09-13 |
| Ic Package With Capacitors Disposed On An Interposal Layer App 20110272785 - Toong; Teik Tiong ; et al. | 2011-11-10 |
| Package Having Spaced Apart Heat Sink App 20110221048 - Lim; Ken Beng ; et al. | 2011-09-15 |
| IC package with capacitors disposed on an interposal layer Grant 7,989,942 - Toong , et al. August 2, 2 | 2011-08-02 |
| Ic Package With Capacitors Disposed On An Interposal Layer App 20100181644 - Toong; Teik Tiong ; et al. | 2010-07-22 |
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