Tonomura; Samuel D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tonomura; Samuel D..The latest application filed is for "hybrid micro-circuit device with stacked chip components".

Company Profile

0.6.8

Tonomura; Samuel D. - Rancho Palos Verdes CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hybrid Micro-circuit Device With Stacked Chip Components App 20180122777 - Wong; Tse E. ; et al.	2018-05-03
Quasi-switched, multi-band, high-power amplifier and method Grant 9,716,471 - Petrucelli , et al. July 25, 2	2017-07-25
Electromagnetic Directional Coupler App 20170179564 - Petrucelli; Anthony M. ; et al.	2017-06-22
Integrated circuit system having stripline structure Grant 9,520,368 - Tonomura , et al. December 13, 2	2016-12-13
Quasi-switched, Multi-band, High-power Amplifier And Method App 20160181984 - Petrucelli; Anthony M. ; et al.	2016-06-23
Stacked integrated circuit assembly Grant 7,888,176 - Wong , et al. February 15, 2	2011-02-15
Stacked Integrated Circuit Assembly App 20100003785 - WONG; Tse E. ; et al.	2010-01-07
Stacked integrated circuit assembly Grant 7,605,477 - Wong , et al. October 20, 2	2009-10-20
Stacked integrated circuit assembly App 20080179758 - Wong; Tse E. ; et al.	2008-07-31
Periodic interleaved star with vias electromagnetic bandgap structure for microstrip and flip chip on board applications Grant 6,949,707 - Tonomura September 27, 2	2005-09-27
Periodic Interleaved Star With Vias Electromagnetic Bandgap Structure For Microstrip And Flip Chip On Board Applications App 20050194169 - Tonomura, Samuel D.	2005-09-08
Flip Chip Mmic On Board Performance Using Periodic Electromagnetic Bandgap Structures App 20050194168 - Tonomura, Samuel D. ; et al.	2005-09-08
Highly Adaptable Heterogeneous Power Amplifier Ic Micro-systems Using Flip Chip And Micromechanical Technologies On Low Loss Substrates App 20040091197 - Tonomura, Samuel D. ; et al.	2004-05-13
Highly adaptable heterogeneous power amplifier IC micro-systems using flip chip and micromechanical technologies on low loss substrates Grant 6,728,432 - Tonomura , et al. April 27, 2	2004-04-27

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