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Packaging Structure And Formation Method Thereof App 20220278075 - SHI; Lei ;   et al. | 2022-09-01 |
Packaging structure Grant 11,430,706 - Shi August 30, 2 | 2022-08-30 |
Packaging Structure And Fabrication Method Thereof App 20220270982 - MIAO; Xiaoyong ;   et al. | 2022-08-25 |
Packaging Structure And Fabrication Method Thereof App 20220246446 - SHI; Lei | 2022-08-04 |
Packaging Structure And Formation Method Thereof App 20220246540 - SHI; Lei ;   et al. | 2022-08-04 |
Semiconductor Packaging Structure App 20210391300 - SHI; Lei | 2021-12-16 |
Semiconductor Chip Package Device App 20210391239 - SHI; Lei | 2021-12-16 |
Semiconductor Packaging Method And Semiconductor Package Device App 20210343763 - YU; Guoqing | 2021-11-04 |
Semiconductor Packaging Method And Semiconductor Package Device App 20210343775 - YU; Guoqing | 2021-11-04 |
Packaging structure and forming method thereof Grant 11,139,267 - Shi October 5, 2 | 2021-10-05 |
Semiconductor chip package method and semiconductor chip package device Grant 11,127,661 - Shi September 21, 2 | 2021-09-21 |
Semiconductor Packaging Method And Semiconductor Package Device App 20210265252 - YU; Guoqing | 2021-08-26 |
Semiconductor Packaging Method And Semiconductor Package Device App 20210265294 - YU; Guoqing | 2021-08-26 |
Semiconductor Packaging Method And Semiconductor Package Device App 20210257334 - YU; Guoqing | 2021-08-19 |
Packaging Structures App 20210233890 - SHI; Lei | 2021-07-29 |
Packaging structure and forming method thereof Grant 10,998,289 - Shi May 4, 2 | 2021-05-04 |
Semiconductor chip package array Grant 10,937,745 - Shi March 2, 2 | 2021-03-02 |
Package structure with improvement layer and fabrication method thereof Grant 10,910,343 - Shi February 2, 2 | 2021-02-02 |
Flip-chip method Grant 10,770,425 - Shi Sep | 2020-09-08 |
System-level packaging structures Grant 10,741,499 - Tao , et al. A | 2020-08-11 |
Package Structure And Fabrication Method Thereof App 20200027859 - SHI; Lei | 2020-01-23 |
Packaging Structure And Forming Method Thereof App 20200027858 - SHI; Lei | 2020-01-23 |
Packaging Structure And Forming Method Thereof App 20200027857 - SHI; Lei | 2020-01-23 |
3D system-level packaging methods and structures Grant 10,515,883 - Tao , et al. Dec | 2019-12-24 |
Packaging Structure App 20190385921 - SHI; Lei | 2019-12-19 |
Semiconductor Chip Package Method And Semiconductor Chip Package Device App 20190385938 - SHI; Lei | 2019-12-19 |
Semiconductor Chip Package Array App 20190385955 - SHI; Lei | 2019-12-19 |
Flip-chip Method App 20190385974 - SHI; Lei | 2019-12-19 |
Testing probe and semiconductor testing fixture, and fabrication methods thereof Grant 10,119,993 - Shi November 6, 2 | 2018-11-06 |
Testing probe, semiconductor testing fixture and fabrication method thereof Grant 10,067,162 - Shi September 4, 2 | 2018-09-04 |
Fabricating method for wafer-level packaging Grant 10,008,478 - Ding June 26, 2 | 2018-06-26 |
Testing probe and semiconductor testing fixture, and fabrication methods thereof Grant 10,006,939 - Shi June 26, 2 | 2018-06-26 |
Semiconductor testing fixture and fabrication method thereof Grant 10,006,943 - Shi June 26, 2 | 2018-06-26 |
Semiconductor testing fixture and fabrication method thereof Grant 10,001,509 - Shi June 19, 2 | 2018-06-19 |
Method and structure for wafer-level packaging Grant 9,922,950 - Gao March 20, 2 | 2018-03-20 |
Structure and method of reinforcing a conductor soldering point of semiconductor device Grant 9,837,371 - Shi , et al. December 5, 2 | 2017-12-05 |
Semiconductor device and fabrication method Grant 9,761,549 - Lin , et al. September 12, 2 | 2017-09-12 |
Method And Structure For Wafer-level Packaging App 20170186717 - GAO; GUOHUA | 2017-06-29 |
Method and structure for wafer-level packaging Grant 9,666,550 - Gao May 30, 2 | 2017-05-30 |
3d System-level Packaging Methods And Structures App 20170133305 - TAO; Yujuan ;   et al. | 2017-05-11 |
Semiconductor packaging structure and method for forming the same Grant 9,620,468 - Lin , et al. April 11, 2 | 2017-04-11 |