TONGFU MICROELECTRONICS CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for TONGFU MICROELECTRONICS CO., LTD..The latest application filed is for "packaging structure and formation method thereof".

Company Profile

14.38.21

TONGFU MICROELECTRONICS CO., LTD. - Nantong CN
TONGFU MICROELECTRONICS CO., LTD - Nantong CN
TONGFU MICROELECTRONICS CO., LTD. - Nantong, Jiangsu N/A CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaging Structure And Formation Method Thereof App 20220278075 - SHI; Lei ; et al.	2022-09-01
Packaging structure Grant 11,430,706 - Shi August 30, 2	2022-08-30
Packaging Structure And Fabrication Method Thereof App 20220270982 - MIAO; Xiaoyong ; et al.	2022-08-25
Packaging Structure And Fabrication Method Thereof App 20220246446 - SHI; Lei	2022-08-04
Packaging Structure And Formation Method Thereof App 20220246540 - SHI; Lei ; et al.	2022-08-04
Semiconductor Packaging Structure App 20210391300 - SHI; Lei	2021-12-16
Semiconductor Chip Package Device App 20210391239 - SHI; Lei	2021-12-16
Semiconductor Packaging Method And Semiconductor Package Device App 20210343763 - YU; Guoqing	2021-11-04
Semiconductor Packaging Method And Semiconductor Package Device App 20210343775 - YU; Guoqing	2021-11-04
Packaging structure and forming method thereof Grant 11,139,267 - Shi October 5, 2	2021-10-05
Semiconductor chip package method and semiconductor chip package device Grant 11,127,661 - Shi September 21, 2	2021-09-21
Semiconductor Packaging Method And Semiconductor Package Device App 20210265252 - YU; Guoqing	2021-08-26
Semiconductor Packaging Method And Semiconductor Package Device App 20210265294 - YU; Guoqing	2021-08-26
Semiconductor Packaging Method And Semiconductor Package Device App 20210257334 - YU; Guoqing	2021-08-19
Packaging Structures App 20210233890 - SHI; Lei	2021-07-29
Packaging structure and forming method thereof Grant 10,998,289 - Shi May 4, 2	2021-05-04
Semiconductor chip package array Grant 10,937,745 - Shi March 2, 2	2021-03-02
Package structure with improvement layer and fabrication method thereof Grant 10,910,343 - Shi February 2, 2	2021-02-02
Flip-chip method Grant 10,770,425 - Shi Sep	2020-09-08
System-level packaging structures Grant 10,741,499 - Tao , et al. A	2020-08-11
Package Structure And Fabrication Method Thereof App 20200027859 - SHI; Lei	2020-01-23
Packaging Structure And Forming Method Thereof App 20200027858 - SHI; Lei	2020-01-23
Packaging Structure And Forming Method Thereof App 20200027857 - SHI; Lei	2020-01-23
3D system-level packaging methods and structures Grant 10,515,883 - Tao , et al. Dec	2019-12-24
Packaging Structure App 20190385921 - SHI; Lei	2019-12-19
Semiconductor Chip Package Method And Semiconductor Chip Package Device App 20190385938 - SHI; Lei	2019-12-19
Semiconductor Chip Package Array App 20190385955 - SHI; Lei	2019-12-19
Flip-chip Method App 20190385974 - SHI; Lei	2019-12-19
Testing probe and semiconductor testing fixture, and fabrication methods thereof Grant 10,119,993 - Shi November 6, 2	2018-11-06
Testing probe, semiconductor testing fixture and fabrication method thereof Grant 10,067,162 - Shi September 4, 2	2018-09-04
Fabricating method for wafer-level packaging Grant 10,008,478 - Ding June 26, 2	2018-06-26
Testing probe and semiconductor testing fixture, and fabrication methods thereof Grant 10,006,939 - Shi June 26, 2	2018-06-26
Semiconductor testing fixture and fabrication method thereof Grant 10,006,943 - Shi June 26, 2	2018-06-26
Semiconductor testing fixture and fabrication method thereof Grant 10,001,509 - Shi June 19, 2	2018-06-19
Method and structure for wafer-level packaging Grant 9,922,950 - Gao March 20, 2	2018-03-20
Structure and method of reinforcing a conductor soldering point of semiconductor device Grant 9,837,371 - Shi , et al. December 5, 2	2017-12-05
Semiconductor device and fabrication method Grant 9,761,549 - Lin , et al. September 12, 2	2017-09-12
Method And Structure For Wafer-level Packaging App 20170186717 - GAO; GUOHUA	2017-06-29
Method and structure for wafer-level packaging Grant 9,666,550 - Gao May 30, 2	2017-05-30
3d System-level Packaging Methods And Structures App 20170133305 - TAO; Yujuan ; et al.	2017-05-11
Semiconductor packaging structure and method for forming the same Grant 9,620,468 - Lin , et al. April 11, 2	2017-04-11

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