Tong; Wei Hua

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tong; Wei Hua.The latest application filed is for "methods for fabricating semiconductor structure with condensed silicon germanium layer".

Company Profile

0.10.10

Tong; Wei Hua - Mechanicville NY
Tong; Wei Hua - Grand Cayman KY
Tong; Wei Hua - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conformal nitridation of one or more fin-type transistor layers Grant 9,698,269 - Tong , et al. July 4, 2	2017-07-04
Forming self-aligned NiSi placement with improved performance and yield Grant 9,607,989 - Wu , et al. March 28, 2	2017-03-28
Methods For Fabricating Semiconductor Structure With Condensed Silicon Germanium Layer App 20160254145 - TRIYOSO; Dina H. ; et al.	2016-09-01
Conformal Nitridation Of One Or More Fin-type Transistor Layers App 20160190324 - TONG; Wei Hua ; et al.	2016-06-30
FORMING SELF-ALIGNED NiSi PLACEMENT WITH IMPROVED PERFORMANCE AND YIELD App 20160163702 - WU; Xusheng ; et al.	2016-06-09
Fabricating transistor(s) with raised active regions having angled upper surfaces Grant 9,331,159 - Jha , et al. May 3, 2	2016-05-03
Conformal nitridation of one or more fin-type transistor layers Grant 9,312,145 - Tong , et al. April 12, 2	2016-04-12
Forming a gate by depositing a thin barrier layer on a titanium nitride cap Grant 9,202,697 - Luo , et al. December 1, 2	2015-12-01
Conformal Nitridation Of One Or More Fin-type Transistor Layers App 20150255277 - TONG; Wei Hua ; et al.	2015-09-10
Integrated circuits and methods of forming integrated circuits with interlayer dielectric protection Grant 9,123,783 - Wang , et al. September 1, 2	2015-09-01
Integrated circuits including FINFET devices with shallow trench isolation that includes a thermal oxide layer and methods for making the same Grant 9,087,870 - Tong , et al. July 21, 2	2015-07-21
Systems And Methods For Fabricating Gate Structures For Semiconductor Devices App 20150024585 - LUO; Tien-Ying ; et al.	2015-01-22
Method Of Forming Fins With Recess Shapes App 20150017774 - TONG; Wei Hua ; et al.	2015-01-15
Integrated Circuits Including Finfet Devices With Shallow Trench Isolation That Includes A Thermal Oxide Layer And Methods For Making The Same App 20140353795 - Tong; Wei Hua ; et al.	2014-12-04
Integrated Circuits And Methods Of Forming Integrated Circuits With Interlayer Dielectric Protection App 20140131881 - Wang; Xin ; et al.	2014-05-15
Integrated circuits having replacement gate structures and methods for fabricating the same Grant 8,722,485 - Tong , et al. May 13, 2	2014-05-13
Reduced metal pipe formation in metal silicide contacts Grant 7,935,632 - Tong , et al. May 3, 2	2011-05-03
Reduced Metal Pipe Formation In Metal Silicide Contacts App 20090114997 - TONG; Wei Hua ; et al.	2009-05-07
Double acting cold trap Grant 6,814,812 - Tong , et al. November 9, 2	2004-11-09
Double acting cold trap App 20030226366 - Tong, Wei Hua ; et al.	2003-12-11

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