Tong; Qin-Yi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tong; Qin-Yi.The latest application filed is for "3d ic method and device".
Company Profile
5.44.42
- Tong; Qin-Yi - Durham NC
Patent Activity
| Patent | Date |
|---|---|
| 3D IC method and device Grant 11,289,372 - Enquist , et al. March 29, 2 | 2022-03-29 |
| 3d Ic Method And Device App 20210313225 - Enquist; Paul M. ; et al. | 2021-10-07 |
| 3d Ic Method And Device App 20210280461 - Enquist; Paul M. ; et al. | 2021-09-09 |
| 3D IC method and device Grant 11,011,418 - Enquist , et al. May 18, 2 | 2021-05-18 |
| Method Of Room Temperature Covalent Bonding App 20190344534 - Tong; Qin-Yi | 2019-11-14 |
| Method Of Room Temperature Covalent Bonding App 20190344533 - Tong; Qin-Yi | 2019-11-14 |
| Method of room temperature covalent bonding Grant 10,434,749 - Tong O | 2019-10-08 |
| Method for low temperature bonding and bonded structure Grant 10,312,217 - Tong , et al. | 2019-06-04 |
| 3d Ic Method And Device App 20190148222 - Enquist; Paul M. ; et al. | 2019-05-16 |
| Room Temperature Metal Direct Bonding App 20190115247 - Tong; Qin-Yi ; et al. | 2019-04-18 |
| 3D IC method and device Grant 10,147,641 - Enquist , et al. De | 2018-12-04 |
| Room temperature metal direct bonding Grant 10,141,218 - Tong , et al. Nov | 2018-11-27 |
| 3d Ic Method And Device App 20170316971 - Enquist; Paul M. ; et al. | 2017-11-02 |
| 3D IC method and device Grant 9,716,033 - Enquist , et al. July 25, 2 | 2017-07-25 |
| Method For Low Temperature Bonding And Bonded Structure App 20160322328 - Tong; Qin-Yi ; et al. | 2016-11-03 |
| Method for low temperature bonding and bonded structure Grant 9,391,143 - Tong , et al. July 12, 2 | 2016-07-12 |
| Room temperature metal direct bonding Grant 9,385,024 - Tong , et al. July 5, 2 | 2016-07-05 |
| Method for low temperature bonding and bonded structure Grant 9,331,149 - Tong , et al. May 3, 2 | 2016-05-03 |
| Room Temperature Metal Direct Bonding App 20160086899 - Tong; Qin-Yi ; et al. | 2016-03-24 |
| Method For Low Temperature Bonding And Bonded Structure App 20160086913 - Tong; Qin-Yi ; et al. | 2016-03-24 |
| 3d Ic Method And Device App 20150340285 - ENQUIST; Paul M. ; et al. | 2015-11-26 |
| 3D IC method and device Grant 9,171,756 - Enquist , et al. October 27, 2 | 2015-10-27 |
| Method For Low Temperature Bonding And Bonded Structure App 20150303263 - Tong; Qin-Yi ; et al. | 2015-10-22 |
| Method for low temperature bonding and bonded structure Grant 9,082,627 - Tong , et al. July 14, 2 | 2015-07-14 |
| Method Of Room Temperature Covalent Bonding App 20150064498 - TONG; Qin-Yi | 2015-03-05 |
| Room Temperature Metal Direct Bonding App 20140370658 - TONG; Qin-Yi ; et al. | 2014-12-18 |
| Room temperature metal direct bonding Grant 8,846,450 - Tong , et al. September 30, 2 | 2014-09-30 |
| Method of room temperature covalent bonding Grant 8,841,002 - Tong September 23, 2 | 2014-09-23 |
| Method For Low Temperature Bonding And Bonded Structure App 20140203407 - TONG; Qin-Yi ; et al. | 2014-07-24 |
| Method For Low Temperature Bonding And Bonded Structure App 20140206176 - TONG; Qin-Yi ; et al. | 2014-07-24 |
| 3d Ic Method And Device App 20140187040 - ENQUIST; Paul M. ; et al. | 2014-07-03 |
| 3D IC method and device Grant 8,709,938 - Enquist , et al. April 29, 2 | 2014-04-29 |
| Room Temperature Metal Direct Bonding App 20130233473 - Tong; Qin-yi ; et al. | 2013-09-12 |
| Room temperature metal direct bonding Grant 8,524,533 - Tong , et al. September 3, 2 | 2013-09-03 |
| 3d Ic Method And Device App 20130178062 - Enquist; Paul M. ; et al. | 2013-07-11 |
| 3D IC method and device Grant 8,389,378 - Enquist , et al. March 5, 2 | 2013-03-05 |
| Method Of Room Temperature Covalent Bonding App 20120183808 - TONG; Qin-Yi | 2012-07-19 |
| Method For Low Temperature Bonding And Bonded Structure App 20120097638 - TONG; Qin-Yi ; et al. | 2012-04-26 |
| Method of room temperature covalent bonding Grant 8,163,373 - Tong April 24, 2 | 2012-04-24 |
| Method for low temperature bonding and bonded structure Grant 8,153,505 - Tong , et al. April 10, 2 | 2012-04-10 |
| Method for low temperature bonding and bonded structure Grant 8,053,329 - Tong , et al. November 8, 2 | 2011-11-08 |
| Method Of Room Temperature Covalent Bonding App 20110143150 - TONG; Qin-Yi | 2011-06-16 |
| Method For Low Temperature Bonding And And Bonded Structure App 20110067803 - Tong; Qin-Yi ; et al. | 2011-03-24 |
| Room Temperature Metal Direct Bonding App 20110041329 - Tong; Qin-Yi ; et al. | 2011-02-24 |
| Method for low temperature bonding and bonded structure Grant 7,871,898 - Tong , et al. January 18, 2 | 2011-01-18 |
| Method of room temperature covalent bonding Grant 7,862,885 - Tong January 4, 2 | 2011-01-04 |
| Room temperature metal direct bonding Grant 7,842,540 - Tong , et al. November 30, 2 | 2010-11-30 |
| Method for low temperature bonding and bonded structure Grant 7,807,549 - Tong , et al. October 5, 2 | 2010-10-05 |
| Method For Low Temperature Bonding And Bonded Structure App 20100163169 - TONG; Qin-Yi ; et al. | 2010-07-01 |
| Wafer bonding hermetic encapsulation Grant 7,622,324 - Enquist , et al. November 24, 2 | 2009-11-24 |
| Method For Low Temperature Bonding And Bonded Structure App 20090263953 - Tong; Qin-Yi ; et al. | 2009-10-22 |
| Room temperature metal direct bonding Grant 7,602,070 - Tong , et al. October 13, 2 | 2009-10-13 |
| Method for low temperature bonding and bonded structure Grant 7,553,744 - Tong , et al. June 30, 2 | 2009-06-30 |
| 3d Ic Method And Device App 20090068831 - Enquist; Paul M. ; et al. | 2009-03-12 |
| 3D IC method and device Grant 7,485,968 - Enquist , et al. February 3, 2 | 2009-02-03 |
| Method of detachable direct bonding at low temperatures Grant 7,462,552 - Tong , et al. December 9, 2 | 2008-12-09 |
| Method Of Room Temperature Covalent Bonding App 20080187757 - TONG; Qin-Yi | 2008-08-07 |
| Method for low temperature bonding and bonded structure Grant 7,387,944 - Tong , et al. June 17, 2 | 2008-06-17 |
| Method for low temperature bonding and bonded structure App 20080063878 - Tong; Qin-Yi ; et al. | 2008-03-13 |
| Method for low temperature bonding and bonded structure App 20080053959 - Tong; Qin-Yi ; et al. | 2008-03-06 |
| Method for low temperature bonding and bonded structure Grant 7,335,572 - Tong , et al. February 26, 2 | 2008-02-26 |
| Method of room temperature covalent bonding Grant 7,335,996 - Tong February 26, 2 | 2008-02-26 |
| Method of epitaxial-like wafer bonding at low temperature and bonded structure Grant 7,332,410 - Tong February 19, 2 | 2008-02-19 |
| Room Temperature Metal Direct Bonding App 20070232023 - Tong; Qin-Yi ; et al. | 2007-10-04 |
| 3D IC method and device App 20070037379 - Enquist; Paul M. ; et al. | 2007-02-15 |
| Method of detachable direct bonding at low temperatures App 20060264004 - Tong; Qin-Yi ; et al. | 2006-11-23 |
| Method of room temperature covalent bonding App 20060216904 - Tong; Qin-Yi | 2006-09-28 |
| Method of room temperature covalent bonding Grant 7,109,092 - Tong September 19, 2 | 2006-09-19 |
| Method for low temperature bonding and bonded structure Grant 7,041,178 - Tong , et al. May 9, 2 | 2006-05-09 |
| Method for room temperature metal direct bonding Grant 6,962,835 - Tong , et al. November 8, 2 | 2005-11-08 |
| Room temperature metal direct bonding App 20050161795 - Tong, Qin-Yi ; et al. | 2005-07-28 |
| Method for low temperature bonding and bonded structure Grant 6,902,987 - Tong , et al. June 7, 2 | 2005-06-07 |
| Method for low temperature bonding and bonded structure App 20050079712 - Tong, Qin-Yi ; et al. | 2005-04-14 |
| Wafer bonding hermetic encapsulation App 20050009246 - Enquist, Paul M. ; et al. | 2005-01-13 |
| Method of room temperature covalent bonding App 20040235266 - Tong, Qin-Yi | 2004-11-25 |
| Wafer bonding hermetic encapsulation Grant 6,822,326 - Enquist , et al. November 23, 2 | 2004-11-23 |
| Room temperature metal direct bonding App 20040157407 - Tong, Qin-Yi ; et al. | 2004-08-12 |
| Wafer bonding hermetic encapsulation App 20040058476 - Enquist, Paul M. ; et al. | 2004-03-25 |
| Method for low temperature bonding and bonded structure App 20030211705 - Tong, Qin-Yi ; et al. | 2003-11-13 |
| Method of epitaxial-like wafer bonding at low temperature and bonded structure App 20030141502 - Tong, Qin-Yi | 2003-07-31 |
| Method of epitaxial-like wafer bonding at low temperature and bonded structure Grant 6,563,133 - Tong May 13, 2 | 2003-05-13 |
| Method for the transfer of thin layers monocrystalline material onto a desirable substrate Grant 6,150,239 - Goesele , et al. November 21, 2 | 2000-11-21 |
| Method for the cleaning and direct bonding of solids Grant 5,915,193 - Tong , et al. June 22, 1 | 1999-06-22 |
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