Tong; Michael Shou-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tong; Michael Shou-Ming.The latest application filed is for "reducing delamination between an underfill and a buffer layer in a bond structure".
- Tong; Michael Shou-Ming - San Diego CA US
| Patent | Date |
|---|---|
| Seal ring structure for integrated circuit chips Grant 9,117,831 - Yang , et al. August 25, 2 | 2015-08-25 |
| Reducing delamination between an underfill and a buffer layer in a bond structure Grant 8,963,328 - Yang , et al. February 24, 2 | 2015-02-24 |
| Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure App 20140087522 - Yang; Ching-Jung ; et al. | 2014-03-27 |
| Reducing delamination between an underfill and a buffer layer in a bond structure Grant 8,610,267 - Yang , et al. December 17, 2 | 2013-12-17 |
| Seal Ring Structure For Integrated Circuit Chips App 20120175728 - YANG; Ching-Jung ; et al. | 2012-07-12 |
| Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure App 20120018875 - Yang; Ching-Jung ; et al. | 2012-01-26 |
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