Tong; Ho-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tong; Ho-Ming.The latest application filed is for "semiconductor package and method for processing and bonding a wire".
Company Profile
0.50.53
- Tong; Ho-Ming - Taipei TW
- Tong; Ho-Ming - Taipei City TW
- Tong, Ho Ming - Shrlin Chiu TW
- Tong; Ho-Ming - Yorktown Heights NY
Patent Activity
| Patent | Date |
|---|---|
| Circuit substrate and manufacturing method thereof and package structure and manufacturing method thereof Grant 8,258,009 - Lee , et al. September 4, 2 | 2012-09-04 |
| Wafer and semiconductor package Grant 8,110,931 - Chang , et al. February 7, 2 | 2012-02-07 |
| Semiconductor package and method for packaging a semiconductor package Grant 8,076,786 - Hung , et al. December 13, 2 | 2011-12-13 |
| Thermally enhanced package structure Grant 8,059,422 - Tong , et al. November 15, 2 | 2011-11-15 |
| Semiconductor package and method for processing and bonding a wire Grant 8,053,906 - Chang , et al. November 8, 2 | 2011-11-08 |
| Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package Grant 8,018,075 - Chang , et al. September 13, 2 | 2011-09-13 |
| Semiconductor Package And Method For Processing And Bonding A Wire App 20100007009 - CHANG; Hsiao Chuan ; et al. | 2010-01-14 |
| Semiconductor Package, Method For Enhancing The Bond Of A Bonding Wire, And Method For Manufacturing A Semiconductor Package App 20100007010 - CHANG; Hsiao Chuan ; et al. | 2010-01-14 |
| Wafer And Semiconductor Package App 20100007004 - CHANG; Hsiao Chuan ; et al. | 2010-01-14 |
| Semiconductor Package And Method For Packaging A Semiconductor Package App 20100007011 - HUNG; Chang Ying ; et al. | 2010-01-14 |
| Flip chip package process Grant 7,614,888 - Tong , et al. November 10, 2 | 2009-11-10 |
| Wire-bonding method for wire-bonding apparatus Grant 7,581,666 - Tong , et al. September 1, 2 | 2009-09-01 |
| Two-stage die-bonding method for simultaneous die-bonding of multiple dies Grant 7,547,575 - Tong , et al. June 16, 2 | 2009-06-16 |
| Flip Chip Package Process App 20090087947 - Tong; Ho-Ming ; et al. | 2009-04-02 |
| Manufacturing Process And Structure Of A Thermally Enhanced Package App 20090075027 - Tong; Ho-Ming ; et al. | 2009-03-19 |
| Packaging substrate and manufacturing method thereof Grant 7,445,944 - Tong , et al. November 4, 2 | 2008-11-04 |
| Packaging substrate and manufacturing method thereof App 20080124836 - Tong; Ho-Ming ; et al. | 2008-05-29 |
| Wire-bonding method for wire-bonding apparatus App 20080102539 - Tong; Ho-Ming ; et al. | 2008-05-01 |
| Die Bonder And Die Bonding Method Thereof App 20080085571 - Tong; Ho-Ming ; et al. | 2008-04-10 |
| Packaging substrate and method of manufacturing the same App 20080044931 - Tong; Ho-Ming ; et al. | 2008-02-21 |
| Wire-bonding apparatus and wire-bonding method thereof App 20080035706 - Tong; Ho-Ming ; et al. | 2008-02-14 |
| Wafer-level package structure Grant 7,064,428 - Tong , et al. June 20, 2 | 2006-06-20 |
| Redistribution Layer And Circuit Structure Thereof App 20060103020 - Tong; Ho-Ming ; et al. | 2006-05-18 |
| Semiconductor chip package and method for making the same Grant 7,041,534 - Chao , et al. May 9, 2 | 2006-05-09 |
| Bump manufacturing method Grant 6,989,326 - Tong , et al. January 24, 2 | 2006-01-24 |
| Bump fabrication process Grant 6,967,153 - Tong , et al. November 22, 2 | 2005-11-22 |
| Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps App 20050233571 - Tao, Su ; et al. | 2005-10-20 |
| Bump and fabricating process thereof App 20050200014 - Chen, William Tze-You ; et al. | 2005-09-15 |
| Structure for preventing burnt fuse pad from further electrical connection Grant 6,927,964 - Tong , et al. August 9, 2 | 2005-08-09 |
| Wafer-level Package Structure App 20050161812 - Tong, Ho-Ming ; et al. | 2005-07-28 |
| Plated probe structure Grant 6,891,360 - Beaman , et al. May 10, 2 | 2005-05-10 |
| Under-bump-metallurgy layer for improving adhesion Grant 6,891,274 - Chen , et al. May 10, 2 | 2005-05-10 |
| Semiconductor chip package and method for manufacturing the same App 20050087859 - Chao, Shin Hua ; et al. | 2005-04-28 |
| Method of modifying tin to lead ratio in tin-lead bump Grant 6,877,653 - Tong , et al. April 12, 2 | 2005-04-12 |
| Method of forming bump Grant 6,875,683 - Tong , et al. April 5, 2 | 2005-04-05 |
| Bump and fabricating process thereof Grant 6,864,168 - Chen , et al. March 8, 2 | 2005-03-08 |
| Solder ball fabricating process Grant 6,861,346 - Tong , et al. March 1, 2 | 2005-03-01 |
| Process for fabricating wafer bumps Grant 6,846,719 - Tong , et al. January 25, 2 | 2005-01-25 |
| Bump manufacturing method Grant 6,827,252 - Tong , et al. December 7, 2 | 2004-12-07 |
| Under-ball-metallurgy layer Grant 6,819,002 - Chen , et al. November 16, 2 | 2004-11-16 |
| System for testing device under test and test method thereof App 20040205437 - Yao, Sung-Po ; et al. | 2004-10-14 |
| Semiconductor wafer and testing method for the same Grant 6,768,332 - Lin , et al. July 27, 2 | 2004-07-27 |
| Method for preventing burnt fuse pad from further electrical connection Grant 6,756,256 - Tong , et al. June 29, 2 | 2004-06-29 |
| [structure For Preventing Burnt Fuse Pad From Further Electrical Connection] App 20040114294 - Tong, Ho-Ming ; et al. | 2004-06-17 |
| Under-bump-metallurgy Layer For Improving Adhesion App 20040113273 - Chen, William Tze-You ; et al. | 2004-06-17 |
| [solder Ball Fabricating Process] App 20040112944 - Tong, Ho-Ming ; et al. | 2004-06-17 |
| [bump And Fabricating Process Thereof] App 20040113272 - CHEN, WILLIAM TZE-YOU ; et al. | 2004-06-17 |
| [under-ball-metallurgy Layer] App 20040104484 - Chen, William Tze-You ; et al. | 2004-06-03 |
| Bump fabrication process Grant 6,743,707 - Tong , et al. June 1, 2 | 2004-06-01 |
| Solder ball attaching process Grant 6,732,912 - Tong , et al. May 11, 2 | 2004-05-11 |
| Solder ball fabrication process Grant 6,723,630 - Tong , et al. April 20, 2 | 2004-04-20 |
| Bump fabrication method Grant 6,720,244 - Tong , et al. April 13, 2 | 2004-04-13 |
| [solder Bump] App 20040065949 - Chen, William Tze-You ; et al. | 2004-04-08 |
| Bump manufacturing method Grant 6,716,739 - Tong , et al. April 6, 2 | 2004-04-06 |
| Bumping process Grant 6,713,320 - Tong , et al. March 30, 2 | 2004-03-30 |
| Flip chip package substrate Grant 6,714,421 - Chen , et al. March 30, 2 | 2004-03-30 |
| Semicondutor wafer device App 20040032009 - Fang, Yao-Shin ; et al. | 2004-02-19 |
| Solder paste for fabricating bump Grant 6,692,581 - Tong , et al. February 17, 2 | 2004-02-17 |
| Flip Chip Package Substrate App 20040026797 - Chen, Kun-Ching ; et al. | 2004-02-12 |
| Semiconductor wafer and testing method for the same App 20040021479 - Lin, Yueh Lung ; et al. | 2004-02-05 |
| Solder ball fabricating process Grant 6,673,711 - Tong , et al. January 6, 2 | 2004-01-06 |
| Bump fabrication process Grant 6,664,128 - Tong , et al. December 16, 2 | 2003-12-16 |
| Under-bump-metallurgy Layer App 20030189261 - Tong, Ho-Ming ; et al. | 2003-10-09 |
| Chip Structure And Wire Bonding Process Suited For The Same App 20030189249 - Tong, Ho-Ming ; et al. | 2003-10-09 |
| Flip-chip Bonding Structure And Method Thereof App 20030189260 - TONG, HO-MING ; et al. | 2003-10-09 |
| Lead-free bump fabrication process Grant 6,617,237 - Tong , et al. September 9, 2 | 2003-09-09 |
| Bump Fabrication Process App 20030166330 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Solder Paste For Fabricating Bump App 20030164204 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Solder Ball Attaching Process App 20030164395 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Under-ball metallic layer App 20030164552 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bump fabrication method App 20030166332 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bump Fabrication Process App 20030166331 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bmuping Process App 20030162321 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Lead-free Bump Fabrication Process App 20030162381 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Method For Preventing Burnt Fuse Pad From Further Electrical Connection App 20030162331 - TONG, HO-MING ; et al. | 2003-08-28 |
| Wafer Bump Fabrication Process App 20030162362 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Bonding Structure For Bonding Substrates By Metal Studs App 20030161123 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Wafer-level Package Structure App 20030160323 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Flip Chip Interconnection Structure And Fabrication Process Thereof App 20030160335 - TONG, HO-MING ; et al. | 2003-08-28 |
| Method Of Modifying Tin To Lead Ratio In Tin-lead Bump App 20030160089 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Solder Ball Fabricating Process App 20030162380 - TONG, HO-MING ; et al. | 2003-08-28 |
| Solder Ball Fabrication Process App 20030162379 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Method of forming bump App 20030157790 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump Forming Process App 20030157438 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Process of fabricating bumps App 20030157791 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump manufacturing method App 20030157789 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump Manufacturing Method App 20030157792 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump manufacturing method App 20030155406 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Etching Method For Nickel-vanadium Alloy App 20030146191 - Tong, Ho-Ming ; et al. | 2003-08-07 |
| Bump Fabrication Process App 20030124833 - Tong , Ho-Ming ; et al. | 2003-07-03 |
| Flip-Chip interconnections using lead-free solders Grant 6,224,690 - Andricacos , et al. May 1, 2 | 2001-05-01 |
| Electroplated solder terminal Grant 5,629,564 - Nye, III , et al. May 13, 1 | 1997-05-13 |
| Method of applying flex tape protective coating onto a flex product Grant 5,546,655 - Feger , et al. August 20, 1 | 1996-08-20 |
| Electroplated solder terminal Grant 5,503,286 - Nye, III , et al. April 2, 1 | 1996-04-02 |
| In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing Grant 5,433,651 - Lustig , et al. July 18, 1 | 1995-07-18 |
| Flex tape protective coating Grant 5,360,946 - Feger , et al. November 1, 1 | 1994-11-01 |
| Method of fabricating a reworkable module Grant 5,274,913 - Grebe , et al. January 4, 1 | 1994-01-04 |
| Hermetic package for an electronic device Grant 5,245,136 - Chance , et al. September 14, 1 | 1993-09-14 |
| Electronic substrate multiple location conductor attachment technology Grant 5,233,221 - Bregman , et al. * August 3, 1 | 1993-08-03 |
| Hermetic package for an electronic device and method of manufacturing same Grant 5,194,196 - Chance , et al. March 16, 1 | 1993-03-16 |
| Method of resiliently mounting an integrated circuit chip to enable conformal heat dissipation Grant 5,169,805 - Mok , et al. December 8, 1 | 1992-12-08 |
| Electronic device and heat sink assembly Grant 5,057,909 - Mok , et al. October 15, 1 | 1991-10-15 |
| Apparatus for temperature control of electronic devices Grant 4,970,868 - Grebe , et al. November 20, 1 | 1990-11-20 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 