Tong; Chong Yee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tong; Chong Yee.The latest application filed is for "double sided cooling chip package and method of manufacturing the same".
- Tong; Chong Yee - Melaka MY
- TONG; Chong Yee - Semabok Perdana MY
| Patent | Date |
|---|---|
| Packaged semiconductor device having an encapsulated semiconductor chip Grant 9,852,961 - Tong December 26, 2 | 2017-12-26 |
| Double sided cooling chip package and method of manufacturing the same App 20160005675 - TONG; Chong Yee | 2016-01-07 |
| Packaged Semiconductor Device App 20150061108 - Tong; Chong Yee | 2015-03-05 |
| Semiconductor package with multiple chips and substrate in metal cap Grant 8,916,958 - Tong , et al. December 23, 2 | 2014-12-23 |
| Semiconductor Package With Multiple Chips And Substrate In Metal Cap App 20100270667 - Tong; Chong Yee ; et al. | 2010-10-28 |
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