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Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
Grant 8,895,359 - Tomura , et al. November 25, 2 | 2014-11-25 |
Method of manufacturing mounting structure and mounting structure
Grant 8,436,253 - Higuchi , et al. May 7, 2 | 2013-05-07 |
Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
Grant 8,426,965 - Iwase , et al. April 23, 2 | 2013-04-23 |
Semiconductor device having stable signal transmission at high speed and high frequency
Grant 8,415,794 - Kumazawa , et al. April 9, 2 | 2013-04-09 |
Resin sealing structure for electronic component and resin sealing method for electronic component
Grant 8,358,018 - Imanishi , et al. January 22, 2 | 2013-01-22 |
Semiconductor Device Mounted Structure And Its Manufacturing Method, Semiconductor Device Mounting Method, And Pressing Tool
App 20120298310 - IWASE; Teppei ; et al. | 2012-11-29 |
Semiconductor assembly and multilayer wiring board
Grant 8,283,570 - Tomura , et al. October 9, 2 | 2012-10-09 |
Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
Grant 8,264,079 - Iwase , et al. September 11, 2 | 2012-09-11 |
Semiconductor device and method of manufacturing the same
Grant 8,207,618 - Shimizu , et al. June 26, 2 | 2012-06-26 |
Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus
Grant 8,163,599 - Tomura , et al. April 24, 2 | 2012-04-24 |
Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure
Grant 8,154,123 - Kondou , et al. April 10, 2 | 2012-04-10 |
Semiconductor device mounted structure and semiconductor device mounted method
Grant 8,110,933 - Tomura , et al. February 7, 2 | 2012-02-07 |
Semiconductor device mounted structure with an underfill sealing-bonding resin with voids
Grant 8,106,521 - Iwase , et al. January 31, 2 | 2012-01-31 |
Mounting structure and mounting method
Grant 8,080,884 - Nakamura , et al. December 20, 2 | 2011-12-20 |
Semiconductor Assembly And Multilayer Wiring Board
App 20110279996 - Tomura; Yoshihiro ; et al. | 2011-11-17 |
Semiconductor device
Grant 8,050,049 - Iwase , et al. November 1, 2 | 2011-11-01 |
Method for manufacturing an electrode and electrode component mounted body
Grant 8,033,016 - Hibino , et al. October 11, 2 | 2011-10-11 |
Semiconductor chip and semiconductor device
Grant 7,994,638 - Tomura , et al. August 9, 2 | 2011-08-09 |
Electrode junction structure and manufacturing method thereof
Grant 7,985,078 - Kumazawa , et al. July 26, 2 | 2011-07-26 |
Semiconductor Device, Flip-chip Mounting Method And Flip-chip Mounting Apparatus
App 20110175237 - Tomura; Yoshihiro ; et al. | 2011-07-21 |
Method Of Manufacturing Mounting Structure And Mounting Structure
App 20110061913 - Higuchi; Takayuki ; et al. | 2011-03-17 |
Semiconductor Device And Method For Manufacturing Same
App 20110042808 - Kumazawa; Kentaro ; et al. | 2011-02-24 |
Flip-chip Mounting Method, Flip-chip Mounting Apparatus And Tool Protection Sheet Used In Flip-chip Mounting Apparatus
App 20110020983 - Tomura; Yoshihiro ; et al. | 2011-01-27 |
Semiconductor Device Mounted Structure And Semiconductor Device Mounting Method
App 20110001233 - Iwase; Teppei ; et al. | 2011-01-06 |
Interconnecting board and three-dimensional wiring structure using it
Grant 7,845,954 - Tomura , et al. December 7, 2 | 2010-12-07 |
Semiconductor Device And Method Of Manufacturing The Same
App 20100276803 - Higuchi; Takayuki ; et al. | 2010-11-04 |
Semiconductor Device
App 20100265683 - IWASE; Teppei ; et al. | 2010-10-21 |
Solder Bump, Semiconductor Chip, Method Of Manufacturing The Semiconductor Chip, Conductive Connection Structure, And Method Of Manufacturing The Conductive Connection Structure
App 20100213609 - Kondou; Shigeru ; et al. | 2010-08-26 |
Semiconductor Device And Method Of Manufacturing The Same
App 20100187675 - Shimizu; Kazumichi ; et al. | 2010-07-29 |
Substrate connecting member and connecting structure
Grant 7,762,819 - Mori , et al. July 27, 2 | 2010-07-27 |
Semiconductor Device Mounted Structure And Its Manufacturing Method, Semiconductor Device Mounting Method, And Pressing Tool
App 20100181667 - Iwase; Teppei ; et al. | 2010-07-22 |
Electrode Junction Structure And Manufacturing Method Thereof
App 20100167597 - KUMAZAWA; Kentaro ; et al. | 2010-07-01 |
Semiconductor Chip And Semiconductor Device
App 20100032832 - Tomura; Yoshihiro ; et al. | 2010-02-11 |
Semiconductor Device Mounted Structure And Semiconductor Device Mounted Method
App 20100025847 - Tomura; Yoshihiro ; et al. | 2010-02-04 |
Mounting Structure And Mounting Method
App 20090321926 - Nakamura; Kojiro ; et al. | 2009-12-31 |
Electronic Component And Resin Packaging Method For Electronic Component
App 20090278265 - Imanishi; Makoto ; et al. | 2009-11-12 |
Substrate Connecting Member and Connecting Structure
App 20090215287 - Mori; Masato ; et al. | 2009-08-27 |
Protruding Electrode for Connecting Electronic Component, Electronic Component Mounted Body Using Such Electrode, and Methods for Manufacturing Such Electrode and Electronic Component Mounted Body
App 20080135283 - Hibino; Kunio ; et al. | 2008-06-12 |
Interconnecting Board and Three-Dimensional Wiring Structure Using it
App 20080139013 - Tomura; Yoshihiro ; et al. | 2008-06-12 |
Heat exchanger
App 20070079957 - Tomura; Yoshihiro | 2007-04-12 |
Mounting structure of electronic device
App 20040140571 - Tomura, Yoshihiro ; et al. | 2004-07-22 |
Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body
Grant 6,613,180 - Sunagawa , et al. September 2, 2 | 2003-09-02 |
Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body
App 20030027371 - Sunagawa, Yoshitaka ; et al. | 2003-02-06 |
Semiconductor device having a bump having a rugged side
Grant 6,088,236 - Tomura , et al. July 11, 2 | 2000-07-11 |
Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method
Grant 5,670,826 - Bessho , et al. September 23, 1 | 1997-09-23 |
Method for mounting a semiconductor device on a circuit board
Grant 5,651,179 - Bessho , et al. July 29, 1 | 1997-07-29 |
Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex
Grant 5,640,051 - Tomura , et al. June 17, 1 | 1997-06-17 |
Methods for producing a chip carrier and terminal electrode for a circuit substrate
Grant 5,628,919 - Tomura , et al. May 13, 1 | 1997-05-13 |
Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device
Grant 5,545,589 - Tomura , et al. August 13, 1 | 1996-08-13 |
Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
Grant 5,485,949 - Tomura , et al. January 23, 1 | 1996-01-23 |
Visible light-curing polyester resin composition
Grant 5,017,626 - Tomura , et al. May 21, 1 | 1991-05-21 |
Multiple-point writing instrument including a mechanical pencil unit
Grant 4,202,641 - Tomura May 13, 1 | 1980-05-13 |
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