Tomoyama; Tsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tomoyama; Tsuyoshi.The latest application filed is for "patterning methods".

Company Profile

1.5.8

Tomoyama; Tsuyoshi - Hiroshima JP
Tomoyama; Tsuyoshi - Higashihiroshima JP
Tomoyama; Tsuyoshi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated assemblies having bitline contacts, and methods of forming integrated assemblies Grant 11,056,494 - Tomoyama July 6, 2	2021-07-06
Patterning methods Grant 11,037,800 - Tomoyama , et al. June 15, 2	2021-06-15
Patterning Methods App 20200294814 - Tomoyama; Tsuyoshi ; et al.	2020-09-17
Integrated assemblies having bitline contacts Grant 10,573,654 - Tomoyama Feb	2020-02-25
Integrated Assemblies Having Bitline Contacts, and Methods of Forming Integrated Assemblies App 20200043934 - Tomoyama; Tsuyoshi	2020-02-06
Integrated Assemblies Having Bitline Contacts App 20190386010 - Tomoyama; Tsuyoshi	2019-12-19
Semiconductor device having shallow trench isolation structure Grant 9,741,723 - Tomoyama August 22, 2	2017-08-22
Semiconductor Device Having Shallow Trench Isolation Structure App 20160233297 - TOMOYAMA; Tsuyoshi	2016-08-11
Semiconductor Device And Method Of Manufacturing The Same App 20130270677 - Tomoyama; Tsuyoshi ; et al.	2013-10-17
Semiconductor device and method of manufacturing the same App 20100258907 - Tomoyama; Tsuyoshi ; et al.	2010-10-14
Semiconductor package with bypass capacitor Grant 7,667,317 - Osanai , et al. February 23, 2	2010-02-23
Semiconductor package App 20070273021 - Osanai; Fumiyuki ; et al.	2007-11-29
Semiconductor Device Having Stacked Structure And Method Of Manufacturing The Same App 20070228580 - Shibamoto; Masanori ; et al.	2007-10-04

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