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Patent applications and USPTO patent grants for Tomizawa; Shinichi.The latest application filed is for "production method for silicon wafer and soi wafer, and soi wafer".
Patent | Date |
---|---|
Method of fabricating bonded wafer Grant 7,531,425 - Nakano , et al. May 12, 2 | 2009-05-12 |
Method for producing bonding wafer Grant 6,884,696 - Aga , et al. April 26, 2 | 2005-04-26 |
Production method for silicon wafer and soi wafer, and soi wafer App 20050020030 - Nakano, Masatake ;   et al. | 2005-01-27 |
Bonded wafer producing method and bonded wafer Grant 6,797,632 - Nakano , et al. September 28, 2 | 2004-09-28 |
Method for producing bonding wafer App 20030181001 - Aga, Hiroji ;   et al. | 2003-09-25 |
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