Tomizawa; Shinichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tomizawa; Shinichi.The latest application filed is for "production method for silicon wafer and soi wafer, and soi wafer".
- Tomizawa; Shinichi - Annaka JP
- Tomizawa; Shinichi - Gunma JP
- Tomizawa, Shinichi - Annaka-shi Gunma JP
| Patent | Date |
|---|---|
| Method of fabricating bonded wafer Grant 7,531,425 - Nakano , et al. May 12, 2 | 2009-05-12 |
| Method for producing bonding wafer Grant 6,884,696 - Aga , et al. April 26, 2 | 2005-04-26 |
| Production method for silicon wafer and soi wafer, and soi wafer App 20050020030 - Nakano, Masatake ; et al. | 2005-01-27 |
| Bonded wafer producing method and bonded wafer Grant 6,797,632 - Nakano , et al. September 28, 2 | 2004-09-28 |
| Method for producing bonding wafer App 20030181001 - Aga, Hiroji ; et al. | 2003-09-25 |
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