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Thermosetting epoxy resin composition and semiconductor device
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Silicone resin composition for optical semiconductor devices
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White heat-curable silicone resin composition, optoelectronic part case, and molding method
Grant 8,013,056 - Taguchi , et al. September 6, 2 | 2011-09-06 |
White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case
Grant 8,013,057 - Taguchi , et al. September 6, 2 | 2011-09-06 |
Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device
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Thermosetting Epoxy Resin Composition And Semiconductor Device
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Silicone Resin Composition For Optical Semiconductor Devices
App 20100081748 - TAGUCHI; Yusuke ; et al. | 2010-04-01 |
White Thermosetting Silicone Resin Composition For Molding An Optical Semiconductor Case And Optical Semiconductor Case
App 20090239997 - TAGUCHI; Yusuke ; et al. | 2009-09-24 |
Semiconductor-encapsulating Epoxy Resin Composition, Preparation Method, And Semiconductor Device
App 20090192258 - Tada; Tomoyoshi ; et al. | 2009-07-30 |
White Heat-curable Silicone Resin Composition, Optoelectronic Part Case, And Molding Method
App 20090171013 - TAGUCHI; Yusuke ; et al. | 2009-07-02 |
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
Grant 7,122,587 - Shimoda , et al. October 17, 2 | 2006-10-17 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 7,095,125 - Osada , et al. August 22, 2 | 2006-08-22 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,894,091 - Osada , et al. May 17, 2 | 2005-05-17 |
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
Grant 6,783,859 - Osada , et al. August 31, 2 | 2004-08-31 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,723,452 - Kimura , et al. April 20, 2 | 2004-04-20 |
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
App 20040072968 - Shimoda, Tarou ; et al. | 2004-04-15 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
App 20040034161 - Osada, Shoichi ; et al. | 2004-02-19 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,630,745 - Osada , et al. October 7, 2 | 2003-10-07 |
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
App 20030152777 - Osada, Shoichi ; et al. | 2003-08-14 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
App 20030050399 - Kimura, Yasuo ; et al. | 2003-03-13 |
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
App 20020102429 - Asano, Eiichi ; et al. | 2002-08-01 |
Epoxy resin compositions and premolded semiconductor packages
App 20020076558 - Tomiyoshi, Kazutoshi ; et al. | 2002-06-20 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
App 20020016398 - Osada, Shoichi ; et al. | 2002-02-07 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,291,556 - Osada , et al. September 18, 2 | 2001-09-18 |
Epoxy resin compositions and premolded semiconductor packages
App 20010004651 - Tomiyoshi, Kazutoshi ; et al. | 2001-06-21 |
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices
Grant 6,231,997 - Arai , et al. May 15, 2 | 2001-05-15 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,168,872 - Ohashi , et al. January 2, 2 | 2001-01-02 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,162,878 - Osada , et al. December 19, 2 | 2000-12-19 |
Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product
Grant 6,027,812 - Shiobara , et al. February 22, 2 | 2000-02-22 |
Epoxy resin composition
Grant 6,001,901 - Shiobara , et al. December 14, 1 | 1999-12-14 |
Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin
Grant 5,312,878 - Shiobara , et al. May 17, 1 | 1994-05-17 |
Thermosetting resin compositions
Grant 5,300,588 - Shiobara , et al. April 5, 1 | 1994-04-05 |
Semiconductor encapsulating epoxy resin compositions and semiconductor devices
Grant 5,250,637 - Shiobara , et al. October 5, 1 | 1993-10-05 |
Epoxy resin compositions and cured products thereof
Grant 5,225,484 - Shiobara , et al. July 6, 1 | 1993-07-06 |
Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith
Grant 5,166,228 - Shiobara , et al. November 24, 1 | 1992-11-24 |
Semiconductor encapsulating epoxy resin compositions
Grant 5,137,940 - Tomiyoshi , et al. August 11, 1 | 1992-08-11 |
Epoxy resin composition
Grant 5,053,445 - Itoh , et al. October 1, 1 | 1991-10-01 |
Epoxy resin-based curable compositions
Grant 4,902,732 - Itoh , et al. February 20, 1 | 1990-02-20 |
Epoxy resin composition
Grant 4,877,822 - Itoh , et al. October 31, 1 | 1989-10-31 |
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