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name:-0.022972106933594
name:-0.00056982040405273
Tomita; Shinichi Patent Filings

Tomita; Shinichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tomita; Shinichi.The latest application filed is for "charged particle beam device and installation method".

Company Profile
0.19.21
  • Tomita; Shinichi - Tokyo JP
  • Tomita; Shinichi - Hitachi N/A JP
  • Tomita; Shinichi - Hitachinaka JP
  • Tomita, Shinichi - Saga JP
  • Tomita; Shinichi - Owariasahi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Charged particle beam device and installation method
Grant 10,008,361 - Yabu , et al. June 26, 2
2018-06-26
Charged Particle Beam Device And Installation Method
App 20170169988 - YABU; Shuhei ;   et al.
2017-06-15
Charged particle beam device
Grant 9,287,083 - Tomita , et al. March 15, 2
2016-03-15
Charged particle beam apparatus
Grant 9,058,957 - Shigeto , et al. June 16, 2
2015-06-16
Charged-particle radiation apparatus
Grant 9,053,902 - Ebine , et al. June 9, 2
2015-06-09
Charged-particle Radiation Apparatus
App 20140284477 - Ebine; Yuta ;   et al.
2014-09-25
Charged Particle Beam Apparatus
App 20140131590 - Shigeto; Kunji ;   et al.
2014-05-15
Charged Particle Beam Device
App 20130299715 - Tomita; Shinichi ;   et al.
2013-11-14
Charged particle beam apparatus
Grant 8,143,573 - Ito , et al. March 27, 2
2012-03-27
Scanning electron microscope
Grant 8,097,848 - Hatano , et al. January 17, 2
2012-01-17
Charged particle beam apparatus and method for charged particle beam adjustment
Grant 8,026,491 - Ogashiwa , et al. September 27, 2
2011-09-27
Method for manufacturing silicon wafer
Grant 7,902,039 - Tomita , et al. March 8, 2
2011-03-08
Method for manufacturing silicon wafer
Grant 7,781,313 - Tomita , et al. August 24, 2
2010-08-24
Scanning electron microscope
Grant 7,755,045 - Hatano , et al. July 13, 2
2010-07-13
Scanning Electron Microscope
App 20100090109 - HATANO; Michio ;   et al.
2010-04-15
Method for manufacturing silicon wafer
App 20090325385 - Tomita; Shinichi ;   et al.
2009-12-31
Charged Particle Beam Apparatus
App 20090322973 - ITO; Sukehiro ;   et al.
2009-12-31
Scanning Electron Microscope
App 20090230304 - Hatano; Michio ;   et al.
2009-09-17
Method for manufacturing bonded SOI wafer and bonded SOI wafer manufactured thereby
Grant 7,528,049 - Ikeda , et al. May 5, 2
2009-05-05
Bonded Soi Substrate, And Method For Manufacturing The Same
App 20090093106 - TOMITA; Shinichi ;   et al.
2009-04-09
Scanning electron microscope
Grant 7,511,271 - Hatano , et al. March 31, 2
2009-03-31
Bonded SOI substrate, and method for manufacturing the same
Grant 7,442,992 - Tomita , et al. October 28, 2
2008-10-28
Method For Manufacturing Silicon Wafer
App 20080132032 - Tomita; Shinichi ;   et al.
2008-06-05
Laminated substrate, method of manufacturing the substrate, and wafer outer periphery pressing jigs used for the method
Grant 7,378,332 - Tomita , et al. May 27, 2
2008-05-27
Scanning Electron Microscope
App 20080035843 - Hatano; Michio ;   et al.
2008-02-14
Method for manufacturing bonded SOI wafer and bonded SOI wafer manufactured thereby
App 20080020541 - Ikeda; Yasunobu ;   et al.
2008-01-24
Charged particle beam apparatus and method for charged particle beam adjustment
App 20070284542 - Ogashiwa; Takeshi ;   et al.
2007-12-13
SOI substrate and manufacturing method thereof
Grant 7,208,058 - Tomita April 24, 2
2007-04-24
Scanning electron microscope
App 20060186337 - Hatano; Michio ;   et al.
2006-08-24
Bonded SOI substrate, and method for manufacturing the same
App 20060055003 - Tomita; Shinichi ;   et al.
2006-03-16
Laminated substrate, method of manufacturing the substrate, and wafer outer periphery pressing jigs used for the method
App 20050014347 - Tomita, Shinichi ;   et al.
2005-01-20
SOI substrate and manufacturing method thereof
App 20040246795 - Tomita, Shinichi
2004-12-09
Method and apparatus for separating composite substrate
App 20040137697 - Tomita, Shinichi
2004-07-15
Method for bonding substrates
Grant 6,620,285 - Tomita , et al. September 16, 2
2003-09-16
Method for bonding substrates
App 20020040754 - Tomita, Shinichi ;   et al.
2002-04-11
Data input apparatus
Grant 4,725,830 - Kawai , et al. February 16, 1
1988-02-16

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