Tomioka; Kenya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tomioka; Kenya.The latest application filed is for "plating apparatus and method".
- Tomioka; Kenya - Tokyo JP
- Tomioka; Kenya - Yokohama JP
| Patent | Date |
|---|---|
| Plating apparatus and plating liquid removing method Grant 7,241,372 - Sendai , et al. July 10, 2 | 2007-07-10 |
| Plating apparatus and method Grant 7,166,204 - Sendai , et al. January 23, 2 | 2007-01-23 |
| Plating apparatus and method App 20060185976 - Sendai; Satoshi ; et al. | 2006-08-24 |
| Plating apparatus and plating liquid removing method App 20040129575 - Sendai, Satoshi ; et al. | 2004-07-08 |
| Plating apparatus and method App 20040089555 - Sendai, Satoshi ; et al. | 2004-05-13 |
| Plating apparatus and plating liquid removing method Grant 6,689,216 - Sendai , et al. February 10, 2 | 2004-02-10 |
| Plating apparatus and method Grant 6,660,139 - Sendai , et al. December 9, 2 | 2003-12-09 |
| Method and apparatus for plating substrate and plating facility Grant 6,558,518 - Sendai , et al. May 6, 2 | 2003-05-06 |
| Plating apparatus and method App 20030057098 - Sendai, Satoshi ; et al. | 2003-03-27 |
| Wafer plating jig Grant 6,365,020 - Yoshioka , et al. April 2, 2 | 2002-04-02 |
| Plating apparatus and plating liquid removing method App 20020017465 - Sendai, Satoshi ; et al. | 2002-02-14 |
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