TOMINAGA; Ryojiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for TOMINAGA; Ryojiro.The latest application filed is for "cured resin formation method and cured resin formation device".

Company Profile

0.22.31

TOMINAGA; Ryojiro - Okazaki-shi JP
Tominaga; Ryojiro - Ogaka JP
Tominaga; Ryojiro - Ogaki JP
TOMINAGA; Ryojiro - Ogaki-shi JP
Tominaga; Ryojiro - Gifu N/A JP
Tominaga; Ryojiro - Ibi-gun N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cured Resin Formation Method And Cured Resin Formation Device App 20220298267 - TAKEUCHI; Tasuku ; et al.	2022-09-22
Electronic Circuit Production Method Using 3d Layer Shaping App 20220279657 - TOMINAGA; Ryojiro ; et al.	2022-09-01
Method For Manufacturing Circuit Wiring By Three-dimensional Additive Manufacturing App 20220279658 - TOMINAGA; Ryojiro ; et al.	2022-09-01
Method For Manufacturing Stack Components App 20220271010 - TOMINAGA; Ryojiro	2022-08-25
Three-dimensional Molding Machine App 20220264777 - KAWAJIRI; Akihiro ; et al.	2022-08-18
Multilayer Circuit Substrate And Method For Manufacturing The Same App 20220240378 - TAKEUCHI; Tasuku ; et al.	2022-07-28
Shaping Method And Shaping Device App 20220227043 - TSUKADA; Kenji ; et al.	2022-07-21
Circuit Formation Method App 20220039263 - TSUKADA; Kenji ; et al.	2022-02-03
Circuit Formation Method And Circuit Formation Device App 20210267054 - TAKEUCHI; Tasuku ; et al.	2021-08-26
Printed Substrate Forming Method, And Printed Substrate Forming Device App 20210029832 - TOMINAGA; Ryojiro	2021-01-28
Three-dimensional Multi-layer Electronic Device Production Method And Three-dimensional Multi-layer Electronic Device App 20200346452 - TOMINAGA; Ryojiro	2020-11-05
Wiring board with cavity for built-in electronic component and method for manufacturing the same Grant 9,832,878 - Shimizu , et al. November 28, 2	2017-11-28
Wiring board with built-in electronic component and method for manufacturing the same Grant 9,723,728 - Shimizu , et al. August 1, 2	2017-08-01
Wiring substrate and method for manufacturing the same Grant 9,613,893 - Terui , et al. April 4, 2	2017-04-04
Wiring board and method for manufacturing wiring board Grant 9,520,222 - Tominaga , et al. December 13, 2	2016-12-13
Printed Wiring Board And Semiconductor Device Having The Same App 20160095219 - SAKAMOTO; Hajime ; et al.	2016-03-31
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20160073515 - SHIMIZU; Keisuke ; et al.	2016-03-10
Wiring Board With Cavity For Built-in Electronic Component And Method For Manufacturing The Same App 20160044789 - SHIMIZU; Keisuke ; et al.	2016-02-11
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20160037647 - Shimizu; Keisuke ; et al.	2016-02-04
Wiring Substrate And Method For Manufacturing The Same App 20160020164 - TERUI; Makoto ; et al.	2016-01-21
Printed wiring board and method for manufacturing the same Grant 9,232,638 - Kato , et al. January 5, 2	2016-01-05
Method for manufacturing a wiring board Grant 9,226,409 - Ishida , et al. December 29, 2	2015-12-29
Printed wiring board and method for manufacturing printed wiring board Grant 9,117,730 - Tominaga , et al. August 25, 2	2015-08-25
Printed wiring board and method for manufacturing printed wiring board Grant 8,901,431 - Nishioka , et al. December 2, 2	2014-12-02
Method for manufacturing substrate with metal film Grant 8,826,530 - Niki , et al. September 9, 2	2014-09-09
Wiring board and method for manufacturing the same Grant 8,729,405 - Ishida , et al. May 20, 2	2014-05-20
Wiring Board And Method For Manufacturing Wiring Board App 20140091892 - TOMINAGA; Ryojiro ; et al.	2014-04-03
Printed Wiring Board And Method For Manufacturing The Same App 20140054068 - Kato; Hisashi ; et al.	2014-02-27
Wiring board and method for manufacturing the same Grant 8,624,127 - Ishida , et al. January 7, 2	2014-01-07
Wiring board and method for manufacturing the same Grant 8,586,875 - Morita , et al. November 19, 2	2013-11-19
Substrate with metal film and method for manufacturing the same Grant 8,563,873 - Niki , et al. October 22, 2	2013-10-22
Wiring board and method for manufacturing the same Grant 8,541,695 - Ishida , et al. September 24, 2	2013-09-24
Wiring Board And Method For Manufacturing The Same App 20130219714 - Ishida; Atsushi ; et al.	2013-08-29
Multilayer Printed Wiring Board App 20130192879 - MORITA; Haruhiko ; et al.	2013-08-01
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20130168134 - TOMINAGA; Ryojiro ; et al.	2013-07-04
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20120152600 - NISHIOKA; Hiroyuki ; et al.	2012-06-21
Wiring Board And Method For Manufacturing The Same App 20110284282 - Ishida; Atsushi ; et al.	2011-11-24
Wiring Board And Method For Manufacturing The Same App 20110209905 - Morita; Haruhiko ; et al.	2011-09-01
Wiring Board And Method For Manufacturing The Same App 20110209904 - ISHIDA; Atsushi ; et al.	2011-09-01
Wiring Board And Method For Manufacturing The Same App 20110209911 - ISHIDA; Atsushi ; et al.	2011-09-01
Printed Wiring Board And Method For Manufacturing The Same App 20110048775 - ISHIDA; Atsushi ; et al.	2011-03-03
Substrate With Metal Film And Method For Manufacturing The Same App 20100243311 - NIKI; Ayao ; et al.	2010-09-30
Substrate With Metal Film And Method For Manufacturing The Same App 20100243305 - NIKI; Ayao ; et al.	2010-09-30

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