loadpatents
name:-0.024991989135742
name:-0.021806001663208
name:-0.00053596496582031
Tomimori; Hiroaki Patent Filings

Tomimori; Hiroaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tomimori; Hiroaki.The latest application filed is for "method of forming a high-k film on a semiconductor device".

Company Profile
0.20.21
  • Tomimori; Hiroaki - Kanagawa JP
  • Tomimori; Hiroaki - Kawasaki JP
  • Tomimori; Hiroaki - Tokyo JP
  • Tomimori, Hiroaki - Kawasaki-shi JP
  • Tomimori, Hiroaki - Nakahara-ku JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for manufacturing semiconductor device to form a via hole
Grant 7,786,005 - Yamamoto , et al. August 31, 2
2010-08-31
Method of forming a high-k film on a semiconductor device
Grant 7,718,532 - Tomimori , et al. May 18, 2
2010-05-18
Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device
Grant 7,592,266 - Aoki , et al. September 22, 2
2009-09-22
Process for making a semiconductor device having a roughened surface
Grant 7,560,372 - Tomimori , et al. July 14, 2
2009-07-14
Method of forming a high-k film on a semiconductor device
App 20080081445 - Tomimori; Hiroaki ;   et al.
2008-04-03
Removing Solution, Cleaning Method For Semiconductor Substrate, And Process For Production Of Semiconductor Device
App 20080066779 - AOKI; Hidemitsu ;   et al.
2008-03-20
Cleaning solution for semiconductor substrate
Grant 7,312,186 - Takashima , et al. December 25, 2
2007-12-25
Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device
Grant 7,312,160 - Aoki , et al. December 25, 2
2007-12-25
Manufacturing method of semiconductor device
Grant 7,268,087 - Aoki , et al. September 11, 2
2007-09-11
Method of forming a high-k film on a semiconductor device
Grant 7,192,835 - Tomimori , et al. March 20, 2
2007-03-20
Anticorrosive treating concentrate
Grant 7,186,354 - Aoki , et al. March 6, 2
2007-03-06
Semiconductor device having a roughened surface
Grant 7,170,172 - Tomimori , et al. January 30, 2
2007-01-30
Process or making a semiconductor device having a roughened surface
App 20070015351 - Tomimori; Hiroaki ;   et al.
2007-01-18
Washing liquid composition for semiconductor substrate
Grant 7,138,362 - Abe , et al. November 21, 2
2006-11-21
Method for manufacturing semiconductor device
App 20060214300 - Yamamoto; Kenichi ;   et al.
2006-09-28
Post-CMP washing liquid composition
Grant 7,087,562 - Abe , et al. August 8, 2
2006-08-08
Cleaning method, method for fabricating semiconductor device and cleaning solution
Grant 6,998,352 - Aoki , et al. February 14, 2
2006-02-14
Stripping agent composition and method of stripping
Grant 6,992,050 - Koita , et al. January 31, 2
2006-01-31
Semiconductor wafer surface and method of treating a semiconductor wafer surface
Grant 6,897,150 - Aoki , et al. May 24, 2
2005-05-24
Semiconductor device fabricating method and treating liquid
Grant 6,890,864 - Aoki , et al. May 10, 2
2005-05-10
Method of washing a semiconductor wafer
Grant 6,864,187 - Tomimori , et al. March 8, 2
2005-03-08
Manufacturing method of semiconductor device
App 20040266171 - Aoki, Hidemitsu ;   et al.
2004-12-30
Method for manufacturing semiconductor device
App 20040248350 - Tomimori, Hiroaki ;   et al.
2004-12-09
Cleaning water for cleaning a wafer and method of cleaning a wafer
Grant 6,797,648 - Aoki , et al. September 28, 2
2004-09-28
Manufacturing method of semicondcutor device
Grant 6,787,480 - Aoki , et al. September 7, 2
2004-09-07
Cleaning solution for semiconductor substrate
App 20040161933 - Takashima, Masayuki ;   et al.
2004-08-19
Liquid composition for cleaning hydrophobic substrate and cleaning method therewith
App 20040116315 - Aoki, Hidemitsu ;   et al.
2004-06-17
Stripping agent composition and method of stripping
App 20040029051 - Koita, Tatsuya ;   et al.
2004-02-12
Post-CMP washing liquid composition
App 20030216270 - Abe, Yumiko ;   et al.
2003-11-20
Washing liquid composition for semiconductor substrate
App 20030171233 - Abe, Yumiko ;   et al.
2003-09-11
Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device
App 20030139045 - Aoki, Hidemitsu ;   et al.
2003-07-24
Semiconductor device fabricating method and treating liquid
App 20030134507 - Aoki, Hidemitsu ;   et al.
2003-07-17
Method of forming a semiconductor device by simultaneously cleaning both sides of a wafer using different cleaning solutions
Grant 6,592,677 - Tomimori , et al. July 15, 2
2003-07-15
Semiconductor device and method for producing the same
App 20030111731 - Tomimori, Hiroaki ;   et al.
2003-06-19
Wash water or immersion water used during semiconductor manufacturing
App 20030094610 - Aoki, Hidemitsu ;   et al.
2003-05-22
Cleaning method, method for fabricating semiconductor device and cleaning solution
App 20030087524 - Aoki, Hidemitsu ;   et al.
2003-05-08
Semiconductor device fabricating method and treating liquid
App 20030027418 - Aoki, Hidemitsu ;   et al.
2003-02-06
Method of washing a semiconductor wafer
App 20030013310 - Tomimori, Hiroaki ;   et al.
2003-01-16
Cleaning water for cleaning a wafer and method of cleaning a wafer
App 20020189639 - Aoki, Hidemitsu ;   et al.
2002-12-19
Manufacturing method of semiconductor device
App 20020155702 - Aoki, Hidemitsu ;   et al.
2002-10-24
Anticorrosive treating concentrate
App 20010030315 - Aoki, Hidemitsu ;   et al.
2001-10-18

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