Tomikawa; Mitsuhiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tomikawa; Mitsuhiro.The latest application filed is for "thin film capacitor, circuit board incorporating the same, and thin film capacitor manufacturing method".
Company Profile
13.30.31
- Tomikawa; Mitsuhiro - Tokyo JP
- TOMIKAWA; Mitsuhiro - Chuo-ku Tokyo
- Tomikawa; Mitsuhiro - Ogaki JP
- Tomikawa; Mitsuhiro - Ogaki-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Electronic component-incorporating substrate Grant 11,367,626 - Tomikawa , et al. June 21, 2 | 2022-06-21 |
| Electric component embedded structure Grant 11,335,614 - Morita , et al. May 17, 2 | 2022-05-17 |
| Thin-film capacitor and method for manufacturing thin-film capacitor Grant 11,276,531 - Tsunoda , et al. March 15, 2 | 2022-03-15 |
| Thin-film capacitor Grant 11,114,249 - Tsunoda , et al. September 7, 2 | 2021-09-07 |
| Thin Film Capacitor, Circuit Board Incorporating The Same, And Thin Film Capacitor Manufacturing Method App 20210257164 - HIRAOKA; Masahiro ; et al. | 2021-08-19 |
| Thin-film capacitor Grant 10,950,389 - Ishii , et al. March 16, 2 | 2021-03-16 |
| Electric Component Embedded Structure App 20210057296 - MORITA; Takaaki ; et al. | 2021-02-25 |
| Electronic component mounting package Grant 10,886,219 - Yoshikawa , et al. January 5, 2 | 2021-01-05 |
| Electronic component embedded substrate Grant 10,813,220 - Tomikawa , et al. October 20, 2 | 2020-10-20 |
| Thin-film Capacitor And Method For Manufacturing Thin-film Capacitor App 20200258690 - A1 | 2020-08-13 |
| Electronic Component-incorporating Substrate App 20200043751 - TOMIKAWA; Mitsuhiro ; et al. | 2020-02-06 |
| Thin-film Capacitor App 20200013554 - TSUNODA; Koichi ; et al. | 2020-01-09 |
| Electronic Component Housing Package And Electronic Component Housing Method App 20190394915 - TOMIKAWA; Mitsuhiro ; et al. | 2019-12-26 |
| Electronic Component Mounting Package App 20190378791 - YOSHIKAWA; Kazuhiro ; et al. | 2019-12-12 |
| Electronic component embedded substrate Grant 10,483,345 - Tomikawa , et al. Nov | 2019-11-19 |
| Thin-film Capacitor App 20190304701 - ISHII; Daiki ; et al. | 2019-10-03 |
| Thin-film capacitor Grant 10,340,088 - Tsunoda , et al. | 2019-07-02 |
| Electronic component embedded substrate Grant 10,278,290 - Yoshida , et al. | 2019-04-30 |
| Electronic component Grant 10,211,157 - Yoshida , et al. Feb | 2019-02-19 |
| Circuit substrate and method for manufacturing the same Grant 10,143,092 - Mikado , et al. Nov | 2018-11-27 |
| Thin-film Capacitor App 20180240599 - TSUNODA; Koichi ; et al. | 2018-08-23 |
| Electronic Component Embedded Substrate App 20180233553 - TOMIKAWA; Mitsuhiro ; et al. | 2018-08-16 |
| Electronic Component Embedded Substrate App 20180235086 - TOMIKAWA; Mitsuhiro ; et al. | 2018-08-16 |
| Circuit substrate and method for manufacturing the same Grant 9,955,591 - Tomikawa , et al. April 24, 2 | 2018-04-24 |
| Wiring board with built-in electronic component and method for manufacturing the same Grant 9,930,791 - Tomikawa , et al. March 27, 2 | 2018-03-27 |
| Electronic Component Embedded Substrate App 20180027660 - YOSHIDA; Kenichi ; et al. | 2018-01-25 |
| Circuit substrate and method for manufacturing the same Grant 9,872,401 - Tomikawa , et al. January 16, 2 | 2018-01-16 |
| Electronic Component App 20170373009 - YOSHIDA; Kenichi ; et al. | 2017-12-28 |
| Circuit substrate and method for manufacturing the same Grant 9,831,163 - Mikado , et al. November 28, 2 | 2017-11-28 |
| Wiring board with built-in electronic component and method for manufacturing the same Grant 9,743,534 - Tomikawa , et al. August 22, 2 | 2017-08-22 |
| Circuit Substrate And Method For Manufacturing The Same App 20160268189 - MIKADO; Yukinobu ; et al. | 2016-09-15 |
| Circuit substrate and method for manufacturing the same Grant 9,433,097 - Tomikawa , et al. August 30, 2 | 2016-08-30 |
| Circuit Substrate And Method For Manufacturing The Same App 20160242293 - MIKADO; Yukinobu ; et al. | 2016-08-18 |
| Wiring Board With Built-in Metal Block And Method For Manufacturing The Same App 20160143134 - TOMIKAWA; Mitsuhiro ; et al. | 2016-05-19 |
| Multilayer printed wiring board and method for manufacturing multilayer printed wiring board Grant 9,332,657 - Furutani , et al. May 3, 2 | 2016-05-03 |
| Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20160105966 - TOMIKAWA; Mitsuhiro ; et al. | 2016-04-14 |
| Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20160105957 - TOMIKAWA; Mitsuhiro ; et al. | 2016-04-14 |
| Circuit Substrate And Method For Manufacturing The Same App 20160021753 - TOMIKAWA; Mitsuhiro ; et al. | 2016-01-21 |
| Circuit Substrate And Method For Manufacturing The Same App 20160007451 - TOMIKAWA; Mitsuhiro ; et al. | 2016-01-07 |
| Circuit Substrate And Method For Manufacturing The Same App 20160007468 - TOMIKAWA; Mitsuhiro ; et al. | 2016-01-07 |
| Wiring board and method for manufacturing the same Grant 9,232,656 - Mikado , et al. January 5, 2 | 2016-01-05 |
| Printed wiring board Grant 9,204,552 - Furutani , et al. December 1, 2 | 2015-12-01 |
| Printed wiring board Grant 8,891,245 - Furutani , et al. November 18, 2 | 2014-11-18 |
| Wiring board and method for manufacturing the same Grant 8,829,357 - Mikado , et al. September 9, 2 | 2014-09-09 |
| Wiring Board And Method For Manufacturing The Same App 20140153205 - MIKADO; Yukinobu ; et al. | 2014-06-05 |
| Wiring board with built-in imaging device and method for manufacturing same Grant 8,698,269 - Hanai , et al. April 15, 2 | 2014-04-15 |
| Wiring board and method for manufacturing the same Grant 8,693,209 - Mikado , et al. April 8, 2 | 2014-04-08 |
| Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20130256007 - Furutani; Toshiki ; et al. | 2013-10-03 |
| Printed Wiring Board App 20130192884 - FURUTANI; Toshiki ; et al. | 2013-08-01 |
| Multilayer Printed Wiring Board And Method For Manufacturing Multilayer Printed Wiring Board App 20130081870 - FURUTANI; Toshiki ; et al. | 2013-04-04 |
| Printed Wiring Board App 20130081866 - FURUTANI; Toshiki ; et al. | 2013-04-04 |
| Wiring Board And Method For Manufacturing The Same App 20120287586 - Mikado; Yukinobu ; et al. | 2012-11-15 |
| Wiring Board With Built-in Imaging Device And Method For Manufacturing Same App 20120217607 - HANAI; Nobuhiro ; et al. | 2012-08-30 |
| Wiring Board And Method For Manufacturing The Same App 20120186866 - MIKADO; Yukinobu ; et al. | 2012-07-26 |
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