| Patent | Date |
|---|
Conductive Paste Composition
App 20220228015 - MATSUBARA; Toyoharu ; et al. | 2022-07-21 |
Thermosetting electroconductive paste composition, and solar cell and solar cell module both using the same
Grant 10,707,360 - Matsubara , et al. | 2020-07-07 |
Thermosetting Electroconductive Paste Composition, And Solar Cell And Solar Cell Module Both Using The Same
App 20190013422 - MATSUBARA; Toyoharu ; et al. | 2019-01-10 |
Multilayer wiring substrate and manufacturing method of multilayer wiring substrate
Grant 8,604,350 - Himori , et al. December 10, 2 | 2013-12-10 |
Wiring board, wiring board manufacturing method, and via paste
Grant 8,563,872 - Hirai , et al. October 22, 2 | 2013-10-22 |
Wiring Board, Production Method Of The Same, And Via Paste
App 20130068513 - Hirai; Shogo ; et al. | 2013-03-21 |
Multilayer Wiring Board, Production Method Of The Same, And Via Paste
App 20130008698 - Himori; Tsuyoshi ; et al. | 2013-01-10 |
Wiring Board, Wiring Board Manufacturing Method, And Via Paste
App 20110290549 - Hirai; Shogo ; et al. | 2011-12-01 |
Multilayer Wiring Substrate And Manufacturing Method Of Multilayer Wiring Substrate
App 20110278051 - Himori; Tsuyoshi ; et al. | 2011-11-17 |
Flip chip mounting process and flip chip assembly
Grant 8,012,801 - Karashima , et al. September 6, 2 | 2011-09-06 |
Substrate structure
Grant 7,969,741 - Hayakawa , et al. June 28, 2 | 2011-06-28 |
Process for forming bumps and solder bump
Grant 7,799,607 - Karashima , et al. September 21, 2 | 2010-09-21 |
Flexible substrate, multilayer flexible substrate
Grant 7,773,386 - Yamashita , et al. August 10, 2 | 2010-08-10 |
Flip chip mounting process and flip chip assembly
Grant 7,759,162 - Karashima , et al. July 20, 2 | 2010-07-20 |
Electronic component mounting method and electronic component mounting device
Grant 7,752,749 - Shiraishi , et al. July 13, 2 | 2010-07-13 |
Flip Chip Mounting Process And Flip Chip Assembly
App 20100148376 - Karashima; Seiji ; et al. | 2010-06-17 |
Board Structure And Electronic Device
App 20100044100 - Ono; Masahiro ; et al. | 2010-02-25 |
Substrate Structure
App 20100020497 - Hayakawa; Haruo ; et al. | 2010-01-28 |
Flexible substrate having interlaminar junctions, and process for producing the same
Grant 7,531,754 - Yamashita , et al. May 12, 2 | 2009-05-12 |
Portable information terminal apparatus
Grant 7,522,938 - Tomita , et al. April 21, 2 | 2009-04-21 |
Electronic Component Mounting Method and Electronic Component Mounting Device
App 20090049687 - Shiraishi; Tsukasa ; et al. | 2009-02-26 |
Multi-layer Circuit Substrate Manufacturing Method And Multi-layer Circuit Substrate
App 20090032285 - Ueda; Yoji ; et al. | 2009-02-05 |
Flexible substrate, multilayer flexible substrate and process for producing the same
App 20080210458 - Yamashita; Yoshihisa ; et al. | 2008-09-04 |
Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment
App 20080185178 - Okimoto; Rikiya ; et al. | 2008-08-07 |
Flip Chip Mounting Process and Flip Chip Assembly
App 20080017995 - Karashima; Seiji ; et al. | 2008-01-24 |
Flexible substrate, multilayer flexible substrate and process for producing the same
Grant 7,321,496 - Yamashita , et al. January 22, 2 | 2008-01-22 |
Process for Forming Bumps and Solder Bump
App 20070257362 - Karashima; Seiji ; et al. | 2007-11-08 |
Flexible substrate having interlaminar junctions, and process for producing the same
App 20070151756 - Yamashita; Yoshihisa ; et al. | 2007-07-05 |
Flexible substrate having interlaminar junctions, and process for producing the same
Grant 7,205,483 - Yamashita , et al. April 17, 2 | 2007-04-17 |
Portable device
Grant 7,184,617 - Korenaga , et al. February 27, 2 | 2007-02-27 |
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
App 20060283626 - Suzuki; Takeshi ; et al. | 2006-12-21 |
Process for manufacturing a circuit board
Grant 7,103,971 - Suzuki , et al. September 12, 2 | 2006-09-12 |
Wiring board and its production process
Grant 7,056,571 - Tomekawa , et al. June 6, 2 | 2006-06-06 |
Method of manufacturing circuit board
Grant 7,047,629 - Kokufu , et al. May 23, 2 | 2006-05-23 |
Semiconductor module, process for producing the same, and film interposer
App 20060091524 - Karashima; Seiji ; et al. | 2006-05-04 |
Method for manufacturing a circuit board
Grant 6,996,902 - Suzuki , et al. February 14, 2 | 2006-02-14 |
Portable information terminal apparatus
App 20050281555 - Tomita, Yoshihiro ; et al. | 2005-12-22 |
Flexible substrate having interlaminar junctions, and process for producing the same
App 20050205291 - Yamashita, Yoshihisa ; et al. | 2005-09-22 |
Flexible substrate, Multilayer flexible substrate and process for producing the same
App 20050205294 - Yamashita, Yoshihisa ; et al. | 2005-09-22 |
Portable device
App 20050201693 - Korenaga, Tsuguhiro ; et al. | 2005-09-15 |
Circuit substrate having improved connection reliability and a method for manufacturing the same
Grant 6,930,395 - Tomekawa , et al. August 16, 2 | 2005-08-16 |
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
App 20050139384 - Suzuki, Takeshi ; et al. | 2005-06-30 |
Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment
App 20050124197 - Okimoto, Rikiya ; et al. | 2005-06-09 |
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
Grant 6,866,892 - Suzuki , et al. March 15, 2 | 2005-03-15 |
Prepreg for printed wiring board, printed wiring board using the prepreg and method for manufacturing the printed wiring board, and multilayer printed wiring board and method for manufacturing the multilayer printed wiring board
App 20050014035 - Nakagiri, Yasushi ; et al. | 2005-01-20 |
Wiring board and production method thereof
Grant 6,774,316 - Suzuki , et al. August 10, 2 | 2004-08-10 |
Wiring board and its production process
App 20040142154 - Tomekawa, Satoru ; et al. | 2004-07-22 |
Circuit board and its manufacture method
App 20040080918 - Kokufu, Shinobu ; et al. | 2004-04-29 |
Circuit board and its manufacture method
Grant 6,713,688 - Kokufu , et al. March 30, 2 | 2004-03-30 |
Method of producing a circuit board
Grant 6,691,409 - Suzuki , et al. February 17, 2 | 2004-02-17 |
Production method for conductive paste and production method for printed circuit
App 20040020046 - Suzuki, Takeshi ; et al. | 2004-02-05 |
Circuit board and method for manufacturing the same
Grant 6,686,029 - Suzuki , et al. February 3, 2 | 2004-02-03 |
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
App 20040005443 - Suzuki, Takeshi ; et al. | 2004-01-08 |
Circuit board and method for manufacturing the same
App 20030170434 - Suzuki, Takeshi ; et al. | 2003-09-11 |
Circuit board and method for manufacturing the same
App 20030157307 - Suzuki, Takeshi ; et al. | 2003-08-21 |
Circuit board and production of the same
App 20030066683 - Suzuki, Takeshi ; et al. | 2003-04-10 |
Circuit board and its manufacture method
App 20020131248 - Kokufu, Shinobu ; et al. | 2002-09-19 |
Circuit board and method for manufacturing the same
App 20020127379 - Suzuki, Takeshi ; et al. | 2002-09-12 |
Circuit Substrate and manufacturing method thereof
App 20020066961 - Tomekawa, Satoru ; et al. | 2002-06-06 |
Circuit board and production of the same
App 20020038725 - Suzuki, Takeshi ; et al. | 2002-04-04 |
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
App 20020037397 - Suzuki, Takeshi ; et al. | 2002-03-28 |
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