loadpatents
name:-0.0094630718231201
name:-0.0053749084472656
name:-0.0020220279693604
Tomaschko; Jochen Patent Filings

Tomaschko; Jochen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tomaschko; Jochen.The latest application filed is for "semiconductor component including a dielectric layer".

Company Profile
2.4.9
  • Tomaschko; Jochen - Gaeufelden DE
  • Tomaschko; Jochen - Gaufelden DE
  • Tomaschko; Jochen - Herrenberg DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Component Including A Dielectric Layer
App 20220238791 - Monteiro Diniz Reis; Daniel ;   et al.
2022-07-28
Semiconductor Component Including A Dielectric Layer
App 20220231219 - Monteiro Diniz Reis; Daniel ;   et al.
2022-07-21
Microelectronics Device And Method For Producing A Microelectronics Device
App 20210328524 - Tomaschko; Jochen ;   et al.
2021-10-21
Method For Producing A Wafer Connection
App 20210292160 - Heuck; Friedjof ;   et al.
2021-09-23
Bond Structures On Mems Element And Asic Element
App 20200399116 - Heuck; Friedjof ;   et al.
2020-12-24
Method for forming a cavity and a component having a cavity
Grant 10,840,107 - Armbruster , et al. November 17, 2
2020-11-17
Method For Forming A Cavity And A Component Having A Cavity
App 20190348300 - Armbruster; Simon ;   et al.
2019-11-14
Method for forming a cavity and a component having a cavity
Grant 10,431,474 - Armbruster , et al. O
2019-10-01
Method for producing a wafer equipped with transparent plates
Grant 9,663,351 - Armbruster , et al. May 30, 2
2017-05-30
Method For Forming A Cavity And A Component Having A Cavity
App 20170140943 - Armbruster; Simon ;   et al.
2017-05-18
Manufacturing method for a piezoelectric layer arrangement and corresponding piezoelectric layer arrangement
Grant 9,461,234 - Mayer , et al. October 4, 2
2016-10-04
Manufacturing Method For A Piezoelectric Layer Arrangement And Corresponding Piezoelectric Layer Arrangement
App 20160035959 - MAYER; Thomas ;   et al.
2016-02-04
Method for producing a wafer equipped with transparent plates
App 20150232328 - ARMBRUSTER; Simon ;   et al.
2015-08-20

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