Tolia; Anish

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tolia; Anish.The latest application filed is for "multi-step process for depositing copper seed layer in a via".

Company Profile

0.7.3

Tolia; Anish - San Jose CA
Tolia; Anish - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-step process for depositing copper seed layer in a via Grant 6,893,541 - Chiang , et al. May 17, 2	2005-05-17
Multi-step process for depositing copper seed layer in a via App 20030124846 - Chiang, Tony P. ; et al.	2003-07-03
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20030116427 - Ding, Peijun ; et al.	2003-06-26
Process for sputtering copper in a self ionized plasma Grant 6,582,569 - Chiang , et al. June 24, 2	2003-06-24
Direct temperature control for a component of a substrate processing chamber Grant 6,433,314 - Mandrekar , et al. August 13, 2	2002-08-13
Method for igniting a plasma in a sputter reactor Grant 6,413,383 - Chiang , et al. July 2, 2	2002-07-02
Plasma reactor and shields generating self-ionized plasma for sputtering Grant 6,398,929 - Chiang , et al. June 4, 2	2002-06-04
Method and apparatus for removing processing liquid from a processing liquid delivery line App 20020026951 - Tolia, Anish ; et al.	2002-03-07
Plasma treatment for ex-situ contact fill Grant 6,297,147 - Yang , et al. October 2, 2	2001-10-02
Method and apparatus for controlling cooling and heating fluids for a gas distribution plate Grant 6,117,245 - Mandrekar , et al. September 12, 2	2000-09-12

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