TOLENTINO; Erik Nino
Patent Applications and Registrations
Patent applications and USPTO patent grants for TOLENTINO; Erik Nino.The latest application filed is for "reinforced semiconductor die and related methods".
- TOLENTINO; Erik Nino - Seremban MY
| Patent | Date |
|---|---|
| Reinforced Semiconductor Die And Related Methods App 20220254734 - CHEW; Chee Hiong ; et al. | 2022-08-11 |
| Reinforced semiconductor die and related methods Grant 11,348,878 - Tolentino , et al. May 31, 2 | 2022-05-31 |
| Reinforced Semiconductor Die And Related Methods App 20200294935 - TOLENTINO; Erik Nino ; et al. | 2020-09-17 |
| Semiconductor Package and Related Methods App 20200286865 - CHEW; Chee Hiong ; et al. | 2020-09-10 |
| Reinforced semiconductor die and related methods Grant 10,700,018 - Tolentino , et al. | 2020-06-30 |
| Direct Bonded Copper Semiconductor Packages And Related Methods App 20200161209 - TOLENTINO; Erik Nino ; et al. | 2020-05-21 |
| Reinforced Semiconductor Die And Related Methods App 20200144200 - TOLENTINO; Erik Nino ; et al. | 2020-05-07 |
| Direct bonded copper semiconductor packages and related methods Grant 10,546,798 - Tolentino , et al. Ja | 2020-01-28 |
| Direct Bonded Copper Semiconductor Packages And Related Methods App 20180261525 - TOLENTINO; Erik Nino ; et al. | 2018-09-13 |
| Direct bonded copper semiconductor packages and related methods Grant 9,991,185 - Tolentino , et al. June 5, 2 | 2018-06-05 |
| Direct Bonded Copper Semiconductor Packages And Related Methods App 20170221792 - TOLENTINO; Erik Nino ; et al. | 2017-08-03 |
| Direct bonded copper semiconductor packages and related methods Grant 9,659,837 - Tolentino , et al. May 23, 2 | 2017-05-23 |
| Direct Bonded Copper Semiconductor Packages And Related Methods App 20160225693 - Tolentino; Erik Nino ; et al. | 2016-08-04 |
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