Tokyo Tungsten Co., Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tokyo Tungsten Co., Ltd..The latest application filed is for "semiconductor package and method for producing heat-radiating substrate for it".
- Tokyo Tungsten Co., Ltd. - Tokyo JP
- TOKYO TUNGSTEN CO., LTD. -
| Patent | Date |
|---|---|
| Semiconductor package and method for producing heat-radiating substrate for it Grant 6,926,861 - Hirayama , et al. August 9, 2 | 2005-08-09 |
| Semiconductor package and method for producing heat-radiating substrate for it App 20040056352 - Hirayama, Norio ; et al. | 2004-03-25 |
| Semiconductor package and method for producing heat-radiating substrate for it Grant 6,693,353 - Hirayama , et al. February 17, 2 | 2004-02-17 |
| Plasma facing components of nuclear fusion reactors employing tungsten materials Grant 6,610,375 - Akiba , et al. August 26, 2 | 2003-08-26 |
| Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same Grant 6,271,585 - Osada , et al. August 7, 2 | 2001-08-07 |
| Plasma facing components of nuclear fusion reactors employing tungsten materials Grant 6,261,648 - Akiba , et al. July 17, 2 | 2001-07-17 |
| Plastic-packaged semiconductor device having a heat sink matched with a plastic package Grant 5,493,153 - Arikawa , et al. February 20, 1 | 1996-02-20 |
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