Tokunaga; Takafumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tokunaga; Takafumi.The latest application filed is for "method of manufacture of semiconductor integrated circuit device and semiconductor integrated circuit device".

Company Profile

0.18.11

Tokunaga; Takafumi - Iruma JP
Tokunaga; Takafumi - Saitama JP
Tokunaga, Takafumi - Iruma-shi JP
Tokunaga; Takafumi - Saitama-ken JP
Tokunaga; Takafumi - Tokorozawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacture of semiconductor integrated circuit device and semiconductor integrated circuit device Grant 7,737,023 - Uno , et al. June 15, 2	2010-06-15
Method Of Manufacture Of Semiconductor Integrated Circuit Device And Semiconductor Integrated Circuit Device App 20090011592 - Uno; Shouichi ; et al.	2009-01-08
Semiconductor integrated circuit device and method for manufacturing the same Grant 7,427,537 - Tokunaga , et al. September 23, 2	2008-09-23
Method of manufacture of semiconductor integrated circuit Grant 7,419,902 - Uno , et al. September 2, 2	2008-09-02
Semiconductor integrated circuit arrangement fabrication method Grant RE39,895 - Tokunaga , et al. October 23, 2	2007-10-23
Sample surface processing method Grant 7,259,104 - Ono , et al. August 21, 2	2007-08-21
Semiconductor integrated circuit device and method for manufacturing the same App 20060292791 - Tokunaga; Takafumi ; et al.	2006-12-28
Semiconductor integrated circuit device and method for manufacturing the same Grant 7,118,949 - Tokunaga , et al. October 10, 2	2006-10-10
Surface processing method of a specimen and surface processing apparatus of the specimen Grant 7,049,243 - Ono , et al. May 23, 2	2006-05-23
Method of manufacture of semiconductor integrated circuit App 20050186801 - Uno, Shouochi ; et al.	2005-08-25
Semiconductor integrated circuit device and method for manufacturing the same App 20050070099 - Tokunaga, Takafumi ; et al.	2005-03-31
Method and apparatus for treating surface of semiconductor Grant 6,849,191 - Ono , et al. February 1, 2	2005-02-01
Method for manufacturing a semiconductor integrated circuit device Grant 6,838,320 - Tokunaga , et al. January 4, 2	2005-01-04
Surface processing method of a specimen and surface processing apparatus of the specimen App 20040259361 - Ono, Tetsuo ; et al.	2004-12-23
Semiconductor integrated circuit device and process for manufacturing the same Grant 6,791,137 - Yamada , et al. September 14, 2	2004-09-14
Method and apparatus for treating surface of semiconductor Grant 6,767,838 - Ono , et al. July 27, 2	2004-07-27
Specimen surface processing method Grant 6,677,244 - Ono , et al. January 13, 2	2004-01-13
Method for processing surface of sample Grant 6,660,647 - Ono , et al. December 9, 2	2003-12-09
Semiconductor integrated circuit device and process for manufacturing the same App 20030183941 - Yamada, Satoru ; et al.	2003-10-02
Method And Apparatus For Treating Surface Of Semiconductor App 20030132198 - ONO, TETSUO ; et al.	2003-07-17
Plasma processing method App 20020125207 - Ono, Tetsuo ; et al.	2002-09-12
Plasma processing method App 20020123229 - Ono, Tetsuo ; et al.	2002-09-05
Semiconductor integrated circuit device and method for manufacturing the same App 20020047150 - Tokunaga, Takafumi ; et al.	2002-04-25
Semiconductor integrated circuit device and process for manufacturing the same App 20020043680 - Yamada, Satoru ; et al.	2002-04-18
Method of treating surface of sample Grant 6,191,045 - Yoshigai , et al. February 20, 2	2001-02-20
Cleaning liquid for semiconductor devices Grant 5,972,862 - Torii , et al. October 26, 1	1999-10-26
Semiconductor integrated circuit arrangement fabrication method Grant 5,962,347 - Tokunaga , et al. October 5, 1	1999-10-05
Semiconductor integrated circuit arrangement fabrication method Grant 5,874,013 - Tokunaga , et al. February 23, 1	1999-02-23
Process for producing semiconductor integrated circuit device having copper interconnections and/or wirings, and device produced Grant 4,931,410 - Tokunaga , et al. June 5, 1	1990-06-05

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