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Patent applications and USPTO patent grants for Tokuhara; Minoru.The latest application filed is for "cap member for covering sensor unit".
Patent | Date |
---|---|
Cap member for covering sensor unit Grant 8,006,555 - Tokuhara August 30, 2 | 2011-08-30 |
Semiconductor sensor having a flat mounting plate with banks Grant 7,768,124 - Tokuhara August 3, 2 | 2010-08-03 |
Cap member for covering sensor unit App 20090056442 - Tokuhara; Minoru | 2009-03-05 |
Semiconductor sensor having flat mounting plate App 20080197481 - Tokuhara; Minoru | 2008-08-21 |
Magnetic sensor Grant 7,408,344 - Tokuhara August 5, 2 | 2008-08-05 |
Rotation detecting device Grant 7,307,417 - Tokuhara , et al. December 11, 2 | 2007-12-11 |
Rotation Detecting Device App 20070247144 - Tokuhara; Minoru ;   et al. | 2007-10-25 |
Rotation detecting device Grant 7,253,613 - Tokuhara August 7, 2 | 2007-08-07 |
Magnetic sensor App 20070120555 - Tokuhara; Minoru | 2007-05-31 |
Semiconductor pressure sensor Grant 7,207,226 - Wakasugi , et al. April 24, 2 | 2007-04-24 |
Pressure sensor having casing with groove Grant 7,055,391 - Tokuhara June 6, 2 | 2006-06-06 |
Rotation detecting device App 20060097717 - Tokuhara; Minoru ;   et al. | 2006-05-11 |
Semiconductor pressure sensor App 20040194550 - Wakasugi, Nobuyoshi ;   et al. | 2004-10-07 |
Pressure sensor having casing with groove App 20040177697 - Tokuhara, Minoru | 2004-09-16 |
Method for manufacturing sensor apparatus Grant 6,751,858 - Tokuhara , et al. June 22, 2 | 2004-06-22 |
Enhancement of wire bondability in semiconductor device package Grant 6,696,753 - Tokuhara February 24, 2 | 2004-02-24 |
Enhancement of wire bondability in semiconductor device package App 20030214026 - Tokuhara, Minoru | 2003-11-20 |
Method for nanufacturing sensor apparatus App 20020050052 - Tokuhara, Minoru ;   et al. | 2002-05-02 |
Pressure sensor having a sealed water-resistant construction Grant 5,386,730 - Ikeda , et al. February 7, 1 | 1995-02-07 |
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