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name:-0.012686967849731
name:-0.00064587593078613
Tokuhara; Minoru Patent Filings

Tokuhara; Minoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tokuhara; Minoru.The latest application filed is for "cap member for covering sensor unit".

Company Profile
0.10.9
  • Tokuhara; Minoru - Okazaki JP
  • Tokuhara; Minoru - Okazaki-city JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cap member for covering sensor unit
Grant 8,006,555 - Tokuhara August 30, 2
2011-08-30
Semiconductor sensor having a flat mounting plate with banks
Grant 7,768,124 - Tokuhara August 3, 2
2010-08-03
Cap member for covering sensor unit
App 20090056442 - Tokuhara; Minoru
2009-03-05
Semiconductor sensor having flat mounting plate
App 20080197481 - Tokuhara; Minoru
2008-08-21
Magnetic sensor
Grant 7,408,344 - Tokuhara August 5, 2
2008-08-05
Rotation detecting device
Grant 7,307,417 - Tokuhara , et al. December 11, 2
2007-12-11
Rotation Detecting Device
App 20070247144 - Tokuhara; Minoru ;   et al.
2007-10-25
Rotation detecting device
Grant 7,253,613 - Tokuhara August 7, 2
2007-08-07
Magnetic sensor
App 20070120555 - Tokuhara; Minoru
2007-05-31
Semiconductor pressure sensor
Grant 7,207,226 - Wakasugi , et al. April 24, 2
2007-04-24
Pressure sensor having casing with groove
Grant 7,055,391 - Tokuhara June 6, 2
2006-06-06
Rotation detecting device
App 20060097717 - Tokuhara; Minoru ;   et al.
2006-05-11
Semiconductor pressure sensor
App 20040194550 - Wakasugi, Nobuyoshi ;   et al.
2004-10-07
Pressure sensor having casing with groove
App 20040177697 - Tokuhara, Minoru
2004-09-16
Method for manufacturing sensor apparatus
Grant 6,751,858 - Tokuhara , et al. June 22, 2
2004-06-22
Enhancement of wire bondability in semiconductor device package
Grant 6,696,753 - Tokuhara February 24, 2
2004-02-24
Enhancement of wire bondability in semiconductor device package
App 20030214026 - Tokuhara, Minoru
2003-11-20
Method for nanufacturing sensor apparatus
App 20020050052 - Tokuhara, Minoru ;   et al.
2002-05-02
Pressure sensor having a sealed water-resistant construction
Grant 5,386,730 - Ikeda , et al. February 7, 1
1995-02-07

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