Tokiwa; Tsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tokiwa; Tsuyoshi.The latest application filed is for "optical coupling device and high frequency device".

Company Profile

0.7.6

Tokiwa; Tsuyoshi - Yokohama Kanagawa JP
Tokiwa; Tsuyoshi - Beek NL
Tokiwa; Tsuyoshi - Nakatsu JP
Tokiwa, Tsuyoshi - AD Maastricht NL
Tokiwa, Tsuyoshi - Nakatsu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical Coupling Device And High Frequency Device App 20210249391 - Fujihara; Mami ; et al.	2021-08-12
Conductive coating, method for preparing a coating, roller, and method for manufacturing a roller and using a coating Grant 8,679,370 - Jansen , et al. March 25, 2	2014-03-25
Conductive Coating, Method For Preparing A Coating, Roller, And Method For Manufacturing A Roller And Using A Coating App 20130195517 - JANSEN; John ; et al.	2013-08-01
Conductive coating, method for preparing a coating, roller, and method for manufacturing a roller and using a coating Grant 8,419,977 - Jansen , et al. April 16, 2	2013-04-16
Developing roller, developing apparatus comprising the developing roller, and method for providing the developing roller Grant 7,962,077 - Jansen , et al. June 14, 2	2011-06-14
Conductive Coating, Method For Preparing A Coating, Roller, And Method For Manufacturing A Roller And Using A Coating App 20090257790 - Jansen; John ; et al.	2009-10-15
Developing Roller, Developing Apparatus Comprising The Developing Roller, And Method For Providing The Developing Roller App 20090257789 - JANSEN; John ; et al.	2009-10-15
Lead frame for semiconductor device, process for producing the same and semiconductor device using the same Grant 6,646,330 - Kubara , et al. November 11, 2	2003-11-11
Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for elecronic parts having the film App 20020088845 - Tanaka, Hisahiro ; et al.	2002-07-11
Semiconductor device with a coating of Pb-free Sn-base solder and manufacturing method therefor Grant 6,395,583 - Kubara , et al. May 28, 2	2002-05-28
Lead frame for semiconductor device, process for producing the same and semiconductor device using the same App 20020053721 - Kubara, Takashi ; et al.	2002-05-09
Semiconductor devices having tin-based solder film containing no lead and process for producing the devices Grant 6,087,714 - Kubara , et al. July 11, 2	2000-07-11

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