loadpatents
name:-0.024100065231323
name:-0.024258136749268
name:-0.00048398971557617
Tohya; Hirokazu Patent Filings

Tohya; Hirokazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tohya; Hirokazu.The latest application filed is for "compact via transmission line for printed circuit board and design method of the same".

Company Profile
0.22.17
  • Tohya; Hirokazu - Tokyo JP
  • Tohya; Hirokazu - Yamanashi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Via transmission lines for multilayer printed circuit boards
Grant 7,868,257 - Kushta , et al. January 11, 2
2011-01-11
Compact via transmission line for printed circuit board and design method of the same
Grant 7,750,765 - Kushta , et al. July 6, 2
2010-07-06
Line component and semiconductor circuit using line component
Grant 7,656,036 - Nakano , et al. February 2, 2
2010-02-02
Nanoparticle transmission line element and method of fabricating the same
Grant 7,545,241 - Wakabayashi , et al. June 9, 2
2009-06-09
Compact Via Transmission Line For Printed Circuit Board And Design Method Of The Same
App 20090091406 - KUSHTA; Taras ;   et al.
2009-04-09
Compact via transmission line for printed circuit board and its designing method
Grant 7,463,122 - Kushta , et al. December 9, 2
2008-12-09
Strip Line Device, Printed Wiring Board Mounting Member, Circuit Board, Semiconductor Package, And Method Of Forming Same
App 20080053692 - TOHYA; Hirokazu ;   et al.
2008-03-06
Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same
Grant 7,315,226 - Tohya , et al. January 1, 2
2008-01-01
Semiconductor device, semiconductor circuit and method for producing semiconductor device
Grant 7,288,844 - Nakano , et al. October 30, 2
2007-10-30
Wide-band circuit coupled through a transmission line
Grant 7,282,963 - Tohya October 16, 2
2007-10-16
Via transmission lines for multilayer printed circuit boards
App 20070205847 - Kushta; Taras ;   et al.
2007-09-06
Transmission line element and method of frabricating the same
App 20070188275 - Wakabayashi; Yoshiaki ;   et al.
2007-08-16
Element of parallel flat plate line type, a circuit board
Grant 7,242,265 - Masuda , et al. July 10, 2
2007-07-10
Wide-band circuit
App 20070024323 - Tohya; Hirokazu
2007-02-01
Compact via transmission line for printed circuit board and its designing method
App 20060255876 - Kushta; Taras ;   et al.
2006-11-16
Strip line device, member to be mounted on printed wiring board, circuit board, semiconductor package, and its fabricating method
App 20060164189 - Tohya; Hirokazu ;   et al.
2006-07-27
Line element and semiconductor circuit applied with line element
App 20060145309 - Nakano; Takashi ;   et al.
2006-07-06
Coaxial line type components with low characteristic impedance
Grant 7,064,623 - Yoshida , et al. June 20, 2
2006-06-20
Element of parallel flat plate line type, a circuit board
App 20060114076 - Masuda; Koichiro ;   et al.
2006-06-01
Semiconductor device, semiconductor circuit and method for producing semiconductor device
App 20050236651 - Nakano, Takashi ;   et al.
2005-10-27
Method and system for designing circuit layout
Grant 6,938,231 - Yoshida , et al. August 30, 2
2005-08-30
Low-impedance decoupling device
Grant 6,903,438 - Nakano , et al. June 7, 2
2005-06-07
System and method for generating thermal network data and recording medium
Grant 6,895,354 - Matsuyama , et al. May 17, 2
2005-05-17
Shielded strip line device and method of manufacture thereof
Grant 6,873,518 - Masuda , et al. March 29, 2
2005-03-29
Transmission line type components
App 20040150494 - Yoshida, Shiro ;   et al.
2004-08-05
Shielded strip line device and method of manufacture thereof
App 20040105218 - Masuda, Koichiro ;   et al.
2004-06-03
Method and system for designing circuit layout
App 20040073880 - Yoshida, Shiro ;   et al.
2004-04-15
System and method for generating thermal network data and recording medium
App 20040073397 - Matsuyama, Hidehito ;   et al.
2004-04-15
Shielded strip line device and method of manufacture thereof
Grant 6,721,171 - Masuda , et al. April 13, 2
2004-04-13
Low-impedance decoupling device
App 20030189247 - Nakano, Takashi ;   et al.
2003-10-09
Shielded strip line device and method of manufacture thereof
App 20030053286 - Masuda, Koichiro ;   et al.
2003-03-20
Electromagnetic interference suppressing device and circuit
Grant 6,365,828 - Kinoshita , et al. April 2, 2
2002-04-02
Method for designing a decoupling circuit
App 20010014963 - Ando, Noriaki ;   et al.
2001-08-16
Laminate printed circuit board with a magnetic layer
Grant 6,111,479 - Myohga , et al. August 29, 2
2000-08-29
Multi-layered printed wiring board
Grant 6,075,211 - Tohya , et al. June 13, 2
2000-06-13
Printed wiring board with integrated coil inductor
Grant 5,978,231 - Tohya , et al. November 2, 1
1999-11-02
Power circuit
Grant 5,343,378 - Tohya August 30, 1
1994-08-30
DC-DC converter with transformer having a single secondary winding
Grant 5,172,308 - Tohya December 15, 1
1992-12-15
Power supply source control system
Grant 4,698,517 - Tohya , et al. October 6, 1
1987-10-06

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