TOHO ENGINEERING CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for TOHO ENGINEERING CO., LTD..The latest application filed is for "planarizing processing method and planarizing processing device".

Company Profile

6.10.6

TOHO ENGINEERING CO., LTD. - Yokkaichi-Shi JP
TOHO Engineering Co., Ltd. - Yokkaichi-shi, Mie JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Planarization processing device Grant 10,770,301 - Suzuki , et al. Sep	2020-09-08
Planarizing processing method and planarizing processing device Grant 10,665,480 - Suzuki , et al.	2020-05-26
Planarizing Processing Method And Planarizing Processing Device App 20190122904 - SUZUKI; Eisuke ; et al.	2019-04-25
Planarizing processing method and planarizing processing device Grant 10,199,242 - Suzuki , et al. Fe	2019-02-05
Method for processing wide-bandgap semiconductor substrate and apparatus therefor Grant 10,163,645 - Yamauchi , et al. Dec	2018-12-25
Planarization Processing Device App 20180277380 - SUZUKI; Tatsutoshi ; et al.	2018-09-27
Planarizing Processing Method And Planarizing Processing Device App 20170098559 - SUZUKI; Eisuke ; et al.	2017-04-06
Method For Processing Wide-bandgap Semiconductor Substrate And Apparatus Therefor App 20170069506 - YAMAUCHI; Kazuto ; et al.	2017-03-09
Substrate polishing apparatus Grant 9,082,715 - Suzuki , et al. July 14, 2	2015-07-14
Substrate Polishing Apparatus App 20140051249 - SUZUKI; Tatsutoshi ; et al.	2014-02-20

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