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Patent applications and USPTO patent grants for Toh; Shi Wei.The latest application filed is for "process kit for a substrate support".
Patent | Date |
---|---|
Process kit for a substrate support Grant 11,387,134 - Mustafa , et al. July 12, 2 | 2022-07-12 |
Process Kit For A Substrate Support App 20190229007 - MUSTAFA; MUHANNAD ;   et al. | 2019-07-25 |
Substrate processing apparatus and methods Grant 10,256,076 - Toh , et al. | 2019-04-09 |
Device conformity control by low temperature, low pressure, inductively coupled ammonia-nitrogen trifluoride plasma Grant 10,008,388 - Hsieh , et al. June 26, 2 | 2018-06-26 |
Device Conformity Control By Low Temperature, Low Pressure, Inductively Coupled Ammonia-nitrogen Trifluoride Plasma App 20170301556 - HSIEH; Ping Han ;   et al. | 2017-10-19 |
Substrate Processing Apparatus And Methods App 20170117118 - TOH; Shi Wei ;   et al. | 2017-04-27 |
Etch Enhancement Via Controlled Introduction Of Chamber Contaminants App 20160133441 - GERMAIN; JONATHAN ;   et al. | 2016-05-12 |
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