Toh; Chin Hock
Patent Applications and Registrations
Patent applications and USPTO patent grants for Toh; Chin Hock.The latest application filed is for "structure and method of fabricating three-dimensional (3d) metal-insulator-metal (mim) capacitor and resistor in semi-additive plating metal wiring".
- Toh; Chin Hock - Singapore SG
- Toh; Chin Hock - Sibu MY
| Patent | Date |
|---|---|
| Sealing structure for workpiece to substrate bonding in a processing chamber Grant 10,978,334 - Toh , et al. April 13, 2 | 2021-04-13 |
| Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiring Grant 9,954,051 - See , et al. April 24, 2 | 2018-04-24 |
| Packaging structural member Grant 9,704,726 - Toh , et al. July 11, 2 | 2017-07-11 |
| Structure And Method Of Fabricating Three-dimensional (3d) Metal-insulator-metal (mim) Capacitor And Resistor In Semi-additive Plating Metal Wiring App 20170104056 - SEE; Guan Huei ; et al. | 2017-04-13 |
| Sealing Structure For Workpiece To Substrate Bonding In A Processing Chamber App 20160064267 - Toh; Chin Hock ; et al. | 2016-03-03 |
| Packaging Structural Member App 20160005629 - TOH; Chin Hock ; et al. | 2016-01-07 |
| Patterned photoresist to attach a carrier wafer to a silicon device wafer Grant 9,219,044 - Toh , et al. December 22, 2 | 2015-12-22 |
| Thin substrate and mold compound handling using an electrostatic-chucking carrier Grant 9,202,801 - Toh , et al. December 1, 2 | 2015-12-01 |
| Packaging structural member Grant 9,142,487 - Toh , et al. September 22, 2 | 2015-09-22 |
| Semiconductor packages and methods of packaging semiconductor devices Grant 9,117,808 - Toh , et al. August 25, 2 | 2015-08-25 |
| Thin Substrate And Mold Compound Handling Using An Electrostatic-chucking Carrier App 20150137383 - Toh; Chin Hock ; et al. | 2015-05-21 |
| Patterned Photoresist To Attach A Carrier Wafer To A Silicon Device Wafer App 20150140801 - Toh; Chin Hock ; et al. | 2015-05-21 |
| Passivation And Warpage Correction By Nitride Film For Molded Wafers App 20140264954 - WONG; Loke Yuen ; et al. | 2014-09-18 |
| Fabrication Of 3d Chip Stacks Without Carrier Plates App 20140273354 - RAMASWAMI; Sesh ; et al. | 2014-09-18 |
| Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20140225242 - TOH; Chin Hock ; et al. | 2014-08-14 |
| Interposer for semiconductor package Grant 8,772,921 - Toh , et al. July 8, 2 | 2014-07-08 |
| Through silicon via dies and packages Grant 8,741,762 - Liu , et al. June 3, 2 | 2014-06-03 |
| Semiconductor packages and methods of packaging semiconductor devices Grant 8,703,534 - Toh , et al. April 22, 2 | 2014-04-22 |
| Through Silicon Via Dies And Packages App 20140045301 - LIU; Hao ; et al. | 2014-02-13 |
| Semiconductor package and method of packaging semiconductor devices Grant 8,647,924 - Toh , et al. February 11, 2 | 2014-02-11 |
| Through silicon via dies and packages Grant 8,586,465 - Liu , et al. November 19, 2 | 2013-11-19 |
| Packaging Structural Member App 20130119560 - TOH; Chin Hock ; et al. | 2013-05-16 |
| Vented die and package Grant 8,426,246 - Toh , et al. April 23, 2 | 2013-04-23 |
| Mold design and semiconductor package Grant 8,399,985 - Kolan , et al. March 19, 2 | 2013-03-19 |
| Packaging structural member Grant 8,384,203 - Toh , et al. February 26, 2 | 2013-02-26 |
| Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20120193812 - TOH; Chin Hock ; et al. | 2012-08-02 |
| Vented Die And Package App 20120149150 - TOH; Chin Hock ; et al. | 2012-06-14 |
| Interposer For Semiconductor Package App 20120104628 - TOH; Chin Hock ; et al. | 2012-05-03 |
| Vented die and package Grant 8,143,719 - Toh , et al. March 27, 2 | 2012-03-27 |
| Interposer for semiconductor package Grant 8,115,292 - Toh , et al. February 14, 2 | 2012-02-14 |
| Mold Design And Semiconductor Package App 20120018869 - KOLAN; Ravi Kanth ; et al. | 2012-01-26 |
| Mold design and semiconductor package Grant 8,030,761 - Kolan , et al. October 4, 2 | 2011-10-04 |
| Semiconductor package and method of making the same Grant 7,948,095 - Ng , et al. May 24, 2 | 2011-05-24 |
| Semiconductor Package And Method Of Packaging Semiconductor Devices App 20100261313 - TOH; Chin Hock ; et al. | 2010-10-14 |
| Semiconductor Package And Method Of Making The Same App 20100109169 - KOLAN; Ravi Kanth ; et al. | 2010-05-06 |
| Interposer For Semiconductor Package App 20100109142 - Toh; Chin Hock ; et al. | 2010-05-06 |
| Packaging Structural Member App 20100013081 - TOH; Chin Hock ; et al. | 2010-01-21 |
| Vented Die And Package App 20080303031 - TOH; Chin Hock ; et al. | 2008-12-11 |
| Through Silicon Via Dies And Packages App 20080303163 - LIU; Hao ; et al. | 2008-12-11 |
| Mold Design And Semiconductor Package App 20080290505 - KOLAN; Ravi Kanth ; et al. | 2008-11-27 |
| Die stack system and method App 20070210428 - Tan; Wooi Aun ; et al. | 2007-09-13 |
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