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Patent applications and USPTO patent grants for Todter-Konig; Sascha.The latest application filed is for "crosslinkable polymeric materials for dielectric layers in electronic devices".
Patent | Date |
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Crosslinkable polymeric materials for dielectric layers in electronic devices Grant 11,043,643 - Eggert , et al. June 22, 2 | 2021-06-22 |
Crosslinkable Polymeric Materials For Dielectric Layers In Electronic Devices App 20210143348 - Eggert; Martin ;   et al. | 2021-05-13 |
Crosslinkable Polymeric Materials For Dielectric Layers In Electronic Devices App 20180323386 - Eggert; Martin ;   et al. | 2018-11-08 |
Overcoat lacquer Grant 7,728,101 - Lienert , et al. June 1, 2 | 2010-06-01 |
Coating Mass App 20090280237 - Todter-Konig; Sascha ;   et al. | 2009-11-12 |
Impregnating Resin Formulation App 20080064809 - Todter-Konig; Sascha ;   et al. | 2008-03-13 |
Overcoat Lacquer App 20080035016 - Lienert; Klaus-Wilhelm ;   et al. | 2008-02-14 |
Liquid epoxy resin emulsions, method for the production and use thereof Grant 6,949,592 - Lienert , et al. September 27, 2 | 2005-09-27 |
Liquid epoxy resin emulsions, method for the production and use thereof App 20040087685 - Lienert, Klaus-Wilhelm ;   et al. | 2004-05-06 |
Polyamide-imide resin solution and the use thereof for producing wire enamels App 20040006174 - Todter Konig, Sascha ;   et al. | 2004-01-08 |
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