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name:-0.0076539516448975
name:-0.0066900253295898
name:-0.0064959526062012
TOCHIHIRA; Jun Patent Filings

TOCHIHIRA; Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for TOCHIHIRA; Jun.The latest application filed is for "multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil".

Company Profile
5.5.6
  • TOCHIHIRA; Jun - Shizuoka JP
  • Tochihira; Jun - Yaizu JP
  • Tochihira; Jun - Yaizu-shi JP
  • Tochihira; Jun - Shimizu JP
  • Tochihira, Jun - Shimizu-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multilayer Printed Wiring Board, Multilayer Metal-clad Laminated Board, And Resin-coated Metal Foil
App 20210176854 - TAKAHASHI; Hiroaki ;   et al.
2021-06-10
Thermosetting adhesive composition, thermosetting adhesive film, and composite film
Grant 10,822,527 - Tochihira , et al. November 3, 2
2020-11-03
Resin-clad metal foil and flexible printed wiring board
Grant 10,751,976 - Ishikawa , et al. A
2020-08-25
Multilayer printed wiring board and multilayer metal clad laminated board
Grant 10,568,201 - Takahashi , et al. Feb
2020-02-18
Resin-clad Metal Foil And Flexible Printed Wiring Board
App 20190061320 - ISHIKAWA; Yohsuke ;   et al.
2019-02-28
Multilayer Printed Wiring Board And Multilayer Metal Clad Laminated Board
App 20180376579 - TAKAHASHI; Hiroaki ;   et al.
2018-12-27
Multilayer Printed Wiring Board, Multilayer Metal-clad Laminated Board, And Resin-coated Metal Foil
App 20180270945 - TAKAHASHI; Hiroaki ;   et al.
2018-09-20
Thermosetting Adhesive Composition, Thermosetting Adhesive Film, And Composite Film
App 20180258324 - Tochihira; Jun ;   et al.
2018-09-13
Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same
Grant 6,770,370 - Suzuki , et al. August 3, 2
2004-08-03
Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same
App 20030111174 - Suzuki, Naoji ;   et al.
2003-06-19
Liquid adhesive for electronic parts and adhesive tape
Grant 5,863,988 - Hashimoto , et al. January 26, 1
1999-01-26

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