loadpatents
name:-0.0068240165710449
name:-0.021743059158325
name:-0.00058197975158691
Tobben; Dirk Patent Filings

Tobben; Dirk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tobben; Dirk.The latest application filed is for "memory for producing a memory component".

Company Profile
0.17.5
  • Tobben; Dirk - Munich DE
  • Tobben; Dirk - Munchen DE
  • Tobben; Dirk - Muchen DE
  • Tobben; Dirk - Dresden OT Langebruck DE
  • Tobben; Dirk - Langebrueek DE
  • TOBBEN, DIRK - FISHKILL NY
  • Tobben; Dirk - Langebrueck DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for the planarization of a semiconductor structure
Grant 7,030,017 - Hollatz , et al. April 18, 2
2006-04-18
Memory for producing a memory component
Grant 7,012,003 - Tobben March 14, 2
2006-03-14
Memory for producing a memory component
App 20050020009 - Tobben, Dirk
2005-01-27
Integrated circuit having electrical connecting elements
Grant 6,803,612 - Lehr , et al. October 12, 2
2004-10-12
Field effect transistor and fabrication method
Grant 6,765,248 - Tobben , et al. July 20, 2
2004-07-20
Method for the planarization of a semiconductor structure
App 20040127040 - Hollatz, Mark ;   et al.
2004-07-01
Integrated circuit having electrical connecting elements
App 20040057301 - Lehr, Matthias Uwe ;   et al.
2004-03-25
Field effect transistor and fabrication method
App 20030098478 - Tobben, Dirk ;   et al.
2003-05-29
Method of forming a self-aligned antifuse link
Grant 6,465,282 - Tobben , et al. October 15, 2
2002-10-15
Method for expanding trenches by an anisotropic wet etch
Grant 6,426,254 - Kudelka , et al. July 30, 2
2002-07-30
Method For Expanding Trenches By An Anisotropic Wet Etch
App 20010016398 - KUDELKA, STEPHAN ;   et al.
2001-08-23
Self-aligned metal caps for interlevel metal connections
Grant 6,261,950 - Tobben , et al. July 17, 2
2001-07-17
Semiconductor structures and manufacturing methods
Grant 6,245,629 - Tobben June 12, 2
2001-06-12
Formation of controlled trench top isolation layers for vertical transistors
Grant 6,177,698 - Gruening , et al. January 23, 2
2001-01-23
Prevention of photoresist poisoning from dielectric antireflective coating in semiconductor fabrication
Grant 6,103,456 - Tobben , et al. August 15, 2
2000-08-15
Dual damascene process for metal layers and organic intermetal layers
Grant 6,066,569 - Tobben May 23, 2
2000-05-23
Metalization system having an enhanced thermal conductivity
Grant 6,046,503 - Weigand , et al. April 4, 2
2000-04-04
Dual damascene structure
Grant 6,033,977 - Gutsche , et al. March 7, 2
2000-03-07
Multi-level conductive structure including low capacitance material
Grant 5,977,635 - Tobben , et al. November 2, 1
1999-11-02
Method of planarizing the semiconductor structure
Grant 5,963,837 - Ilg , et al. October 5, 1
1999-10-05
Planarization of a non-conformal device layer in semiconductor fabrication
Grant 5,880,007 - Varian , et al. March 9, 1
1999-03-09
Method for forming metallization in semiconductor devices with a self-planarizing material
Grant 5,854,126 - Tobben , et al. December 29, 1
1998-12-29

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