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Patent applications and USPTO patent grants for Tjokro; Novy.The latest application filed is for "metal deposition".
Patent | Date |
---|---|
Metal Deposition App 20220290300 - Vellanki; Ravi ;   et al. | 2022-09-15 |
Rapid Flush Purging During Atomic Layer Deposition App 20220186370 - Nannapaneni; Pragna ;   et al. | 2022-06-16 |
Methods for wet metal seed deposition for bottom up gapfill of features Grant 10,103,056 - Tan , et al. October 16, 2 | 2018-10-16 |
Methods For Wet Metal Seed Deposition For Bottom Up Gapfill Of Features App 20180261502 - Tan; Samantha ;   et al. | 2018-09-13 |
Atomic layer etching for enhanced bottom-up feature fill Grant 9,837,312 - Tan , et al. December 5, 2 | 2017-12-05 |
Process to reduce nodule formation in electroless plating Grant 9,142,416 - Li , et al. September 22, 2 | 2015-09-22 |
Porous dielectrics K value restoration by thermal treatment and or solvent treatment Grant 8,603,913 - Li , et al. December 10, 2 | 2013-12-10 |
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