| Patent | Date |
|---|
Patron service method utilizing near-field communication tag identifiers
Grant 11,363,437 - Tiwari , et al. June 14, 2 | 2022-06-14 |
Patron Service Method Utilizing Near-field Communication Tag Identifiers
App 20210368316 - Tiwari; Rajesh ; et al. | 2021-11-25 |
Pre/post Deployment Customization
App 20200065119 - Cohen; Ariel ; et al. | 2020-02-27 |
Pre/post deployment customization
Grant 10,521,243 - Cohen , et al. Dec | 2019-12-31 |
Conditioner For Chemical-mechanical-planarization Pad And Related Methods
App 20190351527 - TIWARI; Rajesh ; et al. | 2019-11-21 |
CMP pad conditioning assembly
Grant 10,471,567 - Doering , et al. Nov | 2019-11-12 |
Method and apparatus for multiple memory shared collar architecture
Grant 9,971,663 - Bhushan Singh , et al. May 15, 2 | 2018-05-15 |
Continuous write and read operations for memories with latencies
Grant 9,972,402 - Bhushan Singh , et al. May 15, 2 | 2018-05-15 |
Pre/post Deployment Customization
App 20180081702 - Cohen; Ariel ; et al. | 2018-03-22 |
Osn/pcs Collaboration Mechanism Integration
App 20180081505 - Ron; Juan Allo ; et al. | 2018-03-22 |
Cmp Pad Conditioning Assembly
App 20180071891 - Doering; Patrick ; et al. | 2018-03-15 |
Multi-level Clock Gate Controls To Address Scan Mode Power Droop And Voltage Bump Requirement
App 20180019733 - Tiwari; Rajesh ; et al. | 2018-01-18 |
Continuous Write And Read Operations For Memories With Latencies
App 20170309348 - Bhushan Singh; Nishi ; et al. | 2017-10-26 |
Dynamically Configurable Shared Scan Clock Channel Architecture
App 20170184665 - Tiwari; Rajesh ; et al. | 2017-06-29 |
Enhanced Memory Built-in Self-test Architecture For De-featured Memories
App 20170110204 - Kothiala; Abhinav ; et al. | 2017-04-20 |
Scan Programmable Register Controlled Clock Architecture For Testing Asynchronous Domains
App 20160061892 - Tiwari; Rajesh ; et al. | 2016-03-03 |
Method And Apparatus For Multiple Memory Shared Collar Architecture
App 20160062864 - Bhushan Singh; Nishi ; et al. | 2016-03-03 |
Post-Polymer Revealing of Through-Substrate Via Tips
App 20140154880 - Brighton; Jeffrey E. ; et al. | 2014-06-05 |
Die Having Through-substrate Vias With Deformation Protected Tips
App 20140151895 - WEST; JEFFREY ALAN ; et al. | 2014-06-05 |
Through-silicon Via (tsv) Die And Method To Control Warpage
App 20140124900 - WEST; JEFFREY ALAN ; et al. | 2014-05-08 |
Fabricating A Semiconductor Die Having Coefficient Of Thermal Expansion Graded Layer
App 20140080301 - Kirkpatrick; Brian K. ; et al. | 2014-03-20 |
Die having coefficient of thermal expansion graded layer
Grant 8,618,661 - Kirkpatrick , et al. December 31, 2 | 2013-12-31 |
DEVICE HAVING TSVs WITH GETTERING LAYER LATERAL TO TSV TIPS
App 20130113103 - WEST; JEFFREY A. ; et al. | 2013-05-09 |
Die Having Coefficient Of Thermal Expansion Graded Layer
App 20130082385 - KIRKPATRICK; BRIAN K. ; et al. | 2013-04-04 |
Post-polymer Revealing Of Through-substrate Via Tips
App 20130062736 - BRIGHTON; JEFFREY E. ; et al. | 2013-03-14 |
Dual Depth Trench Termination Method For Improving Cu-based Interconnect Integrity
App 20090121358 - Tiwari; Rajesh ; et al. | 2009-05-14 |
Automatic formatting and validating of text for a markup language graphical user interface
Grant 7,519,905 - Kougiouris , et al. April 14, 2 | 2009-04-14 |
Dual depth trench termination method for improving Cu-based interconnect integrity
Grant 7,387,960 - Tiwari , et al. June 17, 2 | 2008-06-17 |
Versatile system for controlling semiconductor topography
Grant 7,010,381 - Patel , et al. March 7, 2 | 2006-03-07 |
Versatile system for variance-based data analysis
Grant 6,941,242 - Patel , et al. September 6, 2 | 2005-09-06 |
Versatile system for variance-based data analysis
App 20050075834 - Patel, Nital S. ; et al. | 2005-04-07 |
Versatile system for controlling semiconductor topography
App 20050064608 - Patel, Nital S. ; et al. | 2005-03-24 |
Dual depth trench termination method for improving Cu-based interconnect integrity
App 20050059189 - Tiwari, Rajesh ; et al. | 2005-03-17 |
Method of preventing seam defects in isolated lines
Grant 6,709,974 - Permana , et al. March 23, 2 | 2004-03-23 |
Automatic formatting and validating of text for a markup language graphical user interface
App 20040039993 - Kougiouris, Panagiotis ; et al. | 2004-02-26 |
Dynamic interaction manager for markup language graphical user interface
App 20040034833 - Kougiouris, Panagiotis ; et al. | 2004-02-19 |
Method of preventing seam defects in isolated lines
App 20030199150 - Permana, David ; et al. | 2003-10-23 |
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
App 20020151167 - Farkas, Janos ; et al. | 2002-10-17 |
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
Grant 6,444,569 - Farkas , et al. September 3, 2 | 2002-09-03 |
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
App 20010027083 - Farkas, Janos ; et al. | 2001-10-04 |
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