Tiu; Kong Bee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tiu; Kong Bee.The latest application filed is for "semiconductor package with lead mounted power bar".
- Tiu; Kong Bee - Port Klang MY
- Tiu; Kong Bee - Selangor MY
- Tiu; Kong Bee - Pandamaran MY
- Tiu, Kong Bee - US
| Patent | Date |
|---|---|
| Semiconductor device with combined power and ground ring structure Grant 9,305,898 - Tiu , et al. April 5, 2 | 2016-04-05 |
| Semiconductor package with lead mounted power bar Grant 9,209,120 - Tiu , et al. December 8, 2 | 2015-12-08 |
| Semiconductor Package With Lead Mounted Power Bar App 20150262924 - Tiu; Kong Bee ; et al. | 2015-09-17 |
| Semiconductor Device With Combined Power And Ground Ring Structure App 20150206834 - TIU; KONG BEE ; et al. | 2015-07-23 |
| Multi-die Sensor Device App 20150137279 - Tiu; Kong Bee ; et al. | 2015-05-21 |
| Quad flat semiconductor device with additional contacts Grant 8,981,541 - Tiu , et al. March 17, 2 | 2015-03-17 |
| Quad Flat Semiconductor Device With Additional Contacts App 20150014833 - Tiu; Kong Bee ; et al. | 2015-01-15 |
| Semiconductor Sensor Device With Metal Lid App 20140374848 - Koh; Wen Shi ; et al. | 2014-12-25 |
| Heat sink for semiconductor package App 20070200225 - Ibrahim; Ruzaini ; et al. | 2007-08-30 |
| Wirebonding insulated wire and capillary therefor Grant 7,261,230 - Harun , et al. August 28, 2 | 2007-08-28 |
| Stacked die semiconductor device Grant 7,211,466 - Lo , et al. May 1, 2 | 2007-05-01 |
| Method of making a stacked die package App 20070026573 - Ismail; Aminuddin ; et al. | 2007-02-01 |
| Method of forming a substrateless semiconductor package Grant 7,160,755 - Lo , et al. January 9, 2 | 2007-01-09 |
| Method of forming a substrateless semiconductor package App 20060234421 - Lo; Wai Yew ; et al. | 2006-10-19 |
| Stacked die semiconductor device App 20050127491 - Lo, Wai Yew ; et al. | 2005-06-16 |
| Stacked die semiconductor device Grant 6,885,093 - Lo , et al. April 26, 2 | 2005-04-26 |
| Wirebonding insulated wire and capillary therefor App 20050045692 - Harun, Fuaida ; et al. | 2005-03-03 |
| Wirebonding insulated wire Grant 6,854,637 - Harun , et al. February 15, 2 | 2005-02-15 |
| Wirebonding insulated wire App 20040164126 - Harun, Fuaida ; et al. | 2004-08-26 |
| Stacked die semiconductor device App 20030230796 - Ismail, Aminuddin ; et al. | 2003-12-18 |
| Stacked die semiconductor device App 20030160312 - Lo, Wai Yew ; et al. | 2003-08-28 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 