Ting; Kuo-Chiang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ting; Kuo-Chiang.The latest application filed is for "chiplet interposer".
Company Profile
33.34.48
- Ting; Kuo-Chiang - Hsinchu TW
- TING; Kuo-Chiang - Hsinchu City TW
- Ting; Kuo-Chiang - Hsin-Chu TW
- Ting; Kuo-Chiang - Hsin-Chu City TW
- Ting; Kuo-Chiang - Yunlin TW
Patent Activity
| Patent | Date |
|---|---|
| Optical transceiver and manufacturing method thereof Grant 11,454,773 - Yu , et al. September 27, 2 | 2022-09-27 |
| Chiplet Interposer App 20220262742 - Hou; Shang-Yun ; et al. | 2022-08-18 |
| Chip-on-wafer structure with chiplet interposer Grant 11,380,611 - Chen , et al. July 5, 2 | 2022-07-05 |
| Photonic Package And Method Of Manufacture App 20220099887 - Yu; Chen-Hua ; et al. | 2022-03-31 |
| Photonic Semiconductor Device And Method Of Manufacture App 20220043208 - Hsia; Hsing-Kuo ; et al. | 2022-02-10 |
| Package structure with a heat dissipating element and method of manufacturing the same Grant 11,164,855 - Chen , et al. November 2, 2 | 2021-11-02 |
| Photonic semiconductor device and method Grant 11,156,772 - Yu , et al. October 26, 2 | 2021-10-26 |
| Semiconductor package structure and method for manufacturing the same Grant 11,139,282 - Ting , et al. October 5, 2 | 2021-10-05 |
| Method Of Fabricating A Finfet Device App 20210305102 - YIN; Joanna Chaw Yane ; et al. | 2021-09-30 |
| Chip-on-wafer Structure With Chiplet Interposer App 20210305146 - Chen; Weiming Chris ; et al. | 2021-09-30 |
| Integrated Circuit Package And Method App 20210225666 - Lin; Shih Ting ; et al. | 2021-07-22 |
| Optical Transceiver and Manufacturing Method Thereof App 20210132310 - Yu; Chen-Hua ; et al. | 2021-05-06 |
| FinFET device Grant 10,978,352 - Yin , et al. April 13, 2 | 2021-04-13 |
| Interconnect Chips App 20210098408 - Ting; Kuo-Chiang ; et al. | 2021-04-01 |
| Photonic Semiconductor Device And Method Of Manufacture App 20210088723 - Yu; Chen-Hua ; et al. | 2021-03-25 |
| Package Structure And Method Of Manufacturing The Same App 20210082894 - Chen; Weiming Chris ; et al. | 2021-03-18 |
| Semiconductor Package And Manufacturing Method Thereof App 20210035884 - Yeh; Ting-Yu ; et al. | 2021-02-04 |
| Photonic Semiconductor Device and Method App 20210018678 - Yu; Chen-Hua ; et al. | 2021-01-21 |
| SRAM Cell and Logic Cell Design App 20200395366 - Chen; Fang ; et al. | 2020-12-17 |
| Interconnect chips Grant 10,867,954 - Ting , et al. December 15, 2 | 2020-12-15 |
| Optical transceiver and manufacturing method thereof Grant 10,866,373 - Yu , et al. December 15, 2 | 2020-12-15 |
| Photonic semiconductor device and method Grant 10,746,923 - Yu , et al. A | 2020-08-18 |
| SRAM cell and logic cell design Grant 10,720,436 - Chen , et al. | 2020-07-21 |
| Interconnect chips Grant 10,720,401 - Ting , et al. | 2020-07-21 |
| Finfet Device App 20200144130 - YIN; Joanna Chaw Yane ; et al. | 2020-05-07 |
| Method For Manufacturing Semiconductor Package Structure App 20200144155 - YEH; TING-YU ; et al. | 2020-05-07 |
| Semiconductor Device And Method For Manufacturing The Same App 20200126900 - TING; KUO-CHIANG ; et al. | 2020-04-23 |
| Semiconductor Device App 20200118979 - Chen; Weiming Chris ; et al. | 2020-04-16 |
| Semiconductor Package Structure And Method For Manufacturing The Same App 20200035655 - TING; KUO-CHIANG ; et al. | 2020-01-30 |
| SRAM Cell and Logic Cell Design App 20200035690 - Chen; Fang ; et al. | 2020-01-30 |
| Method of fabricating a FinFET device Grant 10,546,786 - Yin , et al. Ja | 2020-01-28 |
| Interconnect Chips App 20200027851 - Ting; Kuo-Chiang ; et al. | 2020-01-23 |
| Photonic Semiconductor Device And Method App 20200003950 - Yu; Chen-Hua ; et al. | 2020-01-02 |
| Optical Transceiver and Manufacturing Method Thereof App 20200003975 - Yu; Chen-Hua ; et al. | 2020-01-02 |
| Semiconductor device and method for manufacturing the same Grant 10,515,888 - Ting , et al. Dec | 2019-12-24 |
| Semiconductor package structure having a multi-thermal interface material structure Grant 10,515,869 - Yeh , et al. Dec | 2019-12-24 |
| Semiconductor device and method for manufacturing the same Grant 10,510,722 - Chen , et al. Dec | 2019-12-17 |
| Semiconductor Package Structure Having A Multi-thermal Interface Material Structure App 20190371700 - YEH; TING-YU ; et al. | 2019-12-05 |
| SRAM cell and logic cell design Grant 10,468,418 - Chen , et al. No | 2019-11-05 |
| Packaging with substrates connected by conductive bumps Grant 10,304,800 - Chen , et al. | 2019-05-28 |
| Interconnect Chips App 20190148329 - Ting; Kuo-Chiang ; et al. | 2019-05-16 |
| Semiconductor Device And Method For Manufacturing The Same App 20190088582 - TING; KUO-CHIANG ; et al. | 2019-03-21 |
| Method Of Fabricating A Finfet Device App 20190057908 - YIN; Joanna Chaw Yane ; et al. | 2019-02-21 |
| COWOS structures and method of forming the same Grant 10,170,457 - Chen , et al. J | 2019-01-01 |
| Semiconductor Structure And Manufacturing Method Thereof App 20180374821 - CHEN; WEIMING CHRIS ; et al. | 2018-12-27 |
| Semiconductor Device And Method For Manufacturing The Same App 20180366440 - CHEN; WEIMING CHRIS ; et al. | 2018-12-20 |
| SRAM Cell and Logic Cell Design App 20180337189 - Chen; Fang ; et al. | 2018-11-22 |
| FinFET device Grant 10,062,614 - Yin , et al. August 28, 2 | 2018-08-28 |
| SRAM cell and logic cell design Grant 10,050,042 - Chen , et al. August 14, 2 | 2018-08-14 |
| CoWoS Structures and Method of Forming the Same App 20180190638 - Chen; Wei-Ming ; et al. | 2018-07-05 |
| FinFET with high mobility and strain channel Grant 9,997,629 - Li , et al. June 12, 2 | 2018-06-12 |
| Finfet Device App 20180012809 - Yin; Joanna Chaw Yane ; et al. | 2018-01-11 |
| FinFET device Grant 9,805,984 - Yin , et al. October 31, 2 | 2017-10-31 |
| Sram Cell And Logic Cell Design App 20170221905 - Chen; Fang ; et al. | 2017-08-03 |
| Method of making a FinFET device Grant 9,659,810 - Yin , et al. May 23, 2 | 2017-05-23 |
| Finfet Device App 20170098582 - Yin; Joanna Chaw Yane ; et al. | 2017-04-06 |
| FinFET with High Mobility and Strain Channel App 20160293762 - Li; Hou-Ju ; et al. | 2016-10-06 |
| Methods of forming FinFETs Grant 9,449,971 - TIng , et al. September 20, 2 | 2016-09-20 |
| FinFET with high mobility and strain channel Grant 9,368,628 - Li , et al. June 14, 2 | 2016-06-14 |
| Finfets And Methods Of Forming Finfets App 20160155739 - Ting; Kuo-Chiang ; et al. | 2016-06-02 |
| Structure and method for MOSFETS with high-K and metal gate structure Grant 8,912,610 - Lin , et al. December 16, 2 | 2014-12-16 |
| Method of Making a FinFET Device App 20140291770 - Yin; Joanna Chaw Yane ; et al. | 2014-10-02 |
| FinFET with high mobility and strain channel Grant 8,729,634 - Shen , et al. May 20, 2 | 2014-05-20 |
| Method of making a FinFET device Grant 8,697,515 - Yin , et al. April 15, 2 | 2014-04-15 |
| FinFET with High Mobility and Strain Channel App 20140008736 - Li; Hou-Ju ; et al. | 2014-01-09 |
| FinFET with High Mobility and Strain Channel App 20130334606 - Shen; Chun-Liang ; et al. | 2013-12-19 |
| Method Of Making A Finfet Device App 20130330889 - Yin; Joanna ChawYane ; et al. | 2013-12-12 |
| Structure and Method for MOSFETS with High-K and Metal Gate Structure App 20130119487 - Lin; Jr Jung ; et al. | 2013-05-16 |
| Integrating a DRAM with an SRAM having butted contacts and resulting devices App 20080116496 - Tzeng; Kuo-Chyuan ; et al. | 2008-05-22 |
| Improved Flash Forward Tunneling Voltage (ftv) Flash Memory Device App 20060076605 - Chen; Shih-Ming ; et al. | 2006-04-13 |
| Method to improve flash forward tunneling voltage (FTV) performance Grant 6,995,062 - Chen , et al. February 7, 2 | 2006-02-07 |
| Method to improve flash forward tunneling voltage (FTV) performance App 20050056883 - Chen, Shih-Ming ; et al. | 2005-03-17 |
| Method to improve flash forward tunneling voltage (FTV) performance Grant 6,825,085 - Chen , et al. November 30, 2 | 2004-11-30 |
| Method to improve flash forward tunneling voltage (FTV) performance App 20040092077 - Chen, Shih-Ming ; et al. | 2004-05-13 |
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