| Patent | Date |
|---|
Barrier enhancement process for copper interconnects
App 20060076244 - Ting; Chiu H. ; et al. | 2006-04-13 |
Barrier enhancement process for copper interconnects
App 20030010645 - Ting, Chiu H. ; et al. | 2003-01-16 |
Metallized interconnection structure
Grant 6,492,722 - Cheung , et al. December 10, 2 | 2002-12-10 |
Method for depositing and/or removing material on a substrate
Grant 6,365,025 - Ting , et al. April 2, 2 | 2002-04-02 |
Multiple station processing chamber and method for depositing and/or removing material on a substrate
Grant 6,187,152 - Ting , et al. February 13, 2 | 2001-02-13 |
Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate
Grant 6,183,611 - Ting , et al. February 6, 2 | 2001-02-06 |
Introducing and reclaiming liquid in a wafer processing chamber
Grant 6,179,982 - Ting , et al. January 30, 2 | 2001-01-30 |
Metallized interconnection structure and method of making the same
Grant 6,153,521 - Cheung , et al. November 28, 2 | 2000-11-28 |
Rotating anode for a wafer processing chamber
Grant 6,077,412 - Ting , et al. June 20, 2 | 2000-06-20 |
Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer
Grant 6,022,465 - Ting , et al. February 8, 2 | 2000-02-08 |
Process chamber and method for depositing and/or removing material on a substrate
Grant 6,017,437 - Ting , et al. January 25, 2 | 2000-01-25 |
Integrated vacuum and plating cluster system
Grant 6,017,820 - Ting , et al. January 25, 2 | 2000-01-25 |
Copper replenishment technique for precision copper plating system
Grant 5,997,712 - Ting , et al. December 7, 1 | 1999-12-07 |
Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications
Grant 5,891,513 - Dubin , et al. April 6, 1 | 1999-04-06 |
Sealed semiconductor chip and process for fabricating sealed semiconductor chip
Grant 5,856,705 - Ting January 5, 1 | 1999-01-05 |
Electroless deposition equipment or apparatus and method of performing electroless deposition
Grant 5,830,805 - Shacham-Diamand , et al. November 3, 1 | 1998-11-03 |
Protected encapsulation of catalytic layer for electroless copper interconnect
Grant 5,824,599 - Schacham-Diamand , et al. October 20, 1 | 1998-10-20 |
Sealed semiconductor chip
Grant 5,742,094 - Ting April 21, 1 | 1998-04-21 |
Use of cobalt tungsten phosphide as a barrier material for copper metallization
Grant 5,695,810 - Dubin , et al. December 9, 1 | 1997-12-09 |
Selective electroless copper deposited interconnect plugs for ULSI applications
Grant 5,674,787 - Zhao , et al. October 7, 1 | 1997-10-07 |
Process for fabricating sealed semiconductor chip using silicon nitride passivation film
Grant 5,300,461 - Ting April 5, 1 | 1994-04-05 |
Fully planar metalization process
Grant 5,183,795 - Ting , et al. February 2, 1 | 1993-02-02 |
Electroless deposition for IC fabrication
Grant 5,169,680 - Ting , et al. December 8, 1 | 1992-12-08 |
Chemical modification of spin-on glass for improved performance in IC fabrication
Grant 4,885,262 - Ting , et al. December 5, 1 | 1989-12-05 |
Process for forming MOS transistor with buried oxide regions for insulation
Grant 4,700,454 - Baerg , et al. October 20, 1 | 1987-10-20 |
Process for forming isolated silicon regions and field-effect devices on a silicon substrate
Grant 4,654,958 - Baerg , et al. April 7, 1 | 1987-04-07 |
High sensitivity positive resist layers and mask formation process
Grant 3,934,057 - Moreau , et al. January 20, 1 | 1976-01-20 |
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