Ting; Chih-Yuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ting; Chih-Yuan.The latest application filed is for "integrated circuit".

Company Profile

39.72.80

Ting; Chih-Yuan - Taipei TW
TING; Chih-Yuan - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for back end of line semiconductor device processing Grant 11,398,405 - Wu , et al. July 26, 2	2022-07-26
Integrated Circuit App 20220190237 - PENG; Tai-Yen ; et al.	2022-06-16
Method for manufacturing semiconductor structure Grant 11,355,642 - Hsu , et al. June 7, 2	2022-06-07
Integrated circuit Grant 11,271,150 - Peng , et al. March 8, 2	2022-03-08
Metal Etching Stop Layer in Magnetic Tunnel Junction Memory Cells App 20210384418 - Peng; Tai-Yen ; et al.	2021-12-09
Interconnect Structure and Method of Forming the Same App 20210366766 - Chen; Jeng-Shiou ; et al.	2021-11-25
Pattern fidelity enhancement with directional patterning technology Grant 11,158,509 - Shen , et al. October 26, 2	2021-10-26
Semiconductor Device With Magnetic Tunnel Junctions App 20210313396 - Peng; Tai-Yen ; et al.	2021-10-07
Contact plug without seam hole and methods of forming the same Grant 11,127,630 - Ting , et al. September 21, 2	2021-09-21
Metal etching stop layer in magnetic tunnel junction memory cells Grant 11,101,429 - Peng , et al. August 24, 2	2021-08-24
Interconnect structure and method of forming the same Grant 11,088,021 - Chen , et al. August 10, 2	2021-08-10
Mitigating Pattern Collapse App 20210202306 - Ting; Chih-Yuan ; et al.	2021-07-01
Method of preventing pattern collapse Grant 11,043,453 - Ting , et al. June 22, 2	2021-06-22
Semiconductor device with magnetic tunnel junctions Grant 11,037,981 - Peng , et al. June 15, 2	2021-06-15
Systems and methods for in SITU maintenance of a thin hardmask during an etch process Grant 11,024,515 - Ting , et al. June 1, 2	2021-06-01
Interconnect structure and method of forming the same Grant 10,985,054 - Chen , et al. April 20, 2	2021-04-20
Mitigating pattern collapse Grant 10,950,495 - Ting , et al. March 16, 2	2021-03-16
Patterning Approach For Improved Via Landing Profile App 20210074636 - Ting; Chih-Yuan ; et al.	2021-03-11
Interconnect structure for semiconductor devices Grant 10,923,423 - Ting February 16, 2	2021-02-16
Patterning approach for improved via landing profile Grant 10,861,788 - Ting , et al. December 8, 2	2020-12-08
Interconnect Structure and Method of Forming the Same App 20200343128 - Chen; Jeng-Shiou ; et al.	2020-10-29
Interconnect Structure and Method of Forming the Same App 20200286779 - Chen; Jeng-Shiou ; et al.	2020-09-10
Integrated circuit and fabrication method thereof Grant 10,770,345 - Peng , et al. Sep	2020-09-08
Pattern Fidelity Enhancement with Directional Patterning Technology App 20200279743 - Shen; Yu-Tien ; et al.	2020-09-03
Interconnect structure and method of forming same Grant 10,755,974 - Chu , et al. A	2020-08-25
Integrated Circuit App 20200266340 - PENG; Tai-Yen ; et al.	2020-08-20
Interconnect structure and method of forming the same Grant 10,714,383 - Chen , et al.	2020-07-14
Interconnect structure and method of forming the same Grant 10,679,895 - Chen , et al.	2020-06-09
Pattern fidelity enhancement with directional patterning technology Grant 10,658,184 - Shen , et al.	2020-05-19
Integrated Circuit With Conductive Line Having Line-ends App 20200152507 - Ting; Chih-Yuan	2020-05-14
Memory device and fabrication method thereof Grant 10,651,373 - Peng , et al.	2020-05-12
Semiconductor Device With Magnetic Tunnel Junctions App 20200135806 - Peng; Tai-Yen ; et al.	2020-04-30
Method of Preventing Pattern Collapse App 20200126913 - Ting; Chih-Yuan ; et al.	2020-04-23
Memory Device And Fabrication Method Thereof App 20200106007 - PENG; Tai-Yen ; et al.	2020-04-02
Metal Etching Stop Layer in Magnetic Tunnel Junction Memory Cells App 20200106008 - Peng; Tai-Yen ; et al.	2020-04-02
Integrated Circuit And Fabrication Method Thereof App 20200066580 - PENG; Tai-Yen ; et al.	2020-02-27
Contact Plug without Seam Hole and Methods of Forming the Same App 20200051856 - Ting; Chih-Yuan ; et al.	2020-02-13
Method For Manufacturing Semiconductor Structure App 20200052122 - HSU; Ju-Wang ; et al.	2020-02-13
Interconnect Structure for Semiconductor Devices App 20200043851 - Ting; Chih-Yuan	2020-02-06
Integrated circuit with conductive line having line-ends Grant 10,535,556 - Ting , et al. Ja	2020-01-14
Method and Apparatus for Back End of Line Semiconductor Device Processing App 20200006120 - Wu; Chung-Wen ; et al.	2020-01-02
Method and apparatus for back end of line semiconductor device processing Grant 10,522,391 - Wu , et al. Dec	2019-12-31
Method of preventing pattern collapse Grant 10,515,895 - Ting , et al. Dec	2019-12-24
Contact plug without seam hole and methods of forming the same Grant 10,504,780 - Ting , et al. Dec	2019-12-10
Fin field effect transistor and method of forming the same Grant 10,483,397 - Hsu , et al. Nov	2019-11-19
Interconnect Structure and Method of Forming the Same App 20190326156 - Chen; Jeng-Shiou ; et al.	2019-10-24
Interconnect structure for semiconductor devices Grant 10,453,794 - Ting Oc	2019-10-22
Semiconductor Device and Method App 20190259661 - Chu; Ming-Hui ; et al.	2019-08-22
Air gap structure and method Grant 10,354,949 - Ting , et al. July 16, 2	2019-07-16
Novel Patterning Approach For Improved Via Landing Profile App 20190148294 - Ting; Chih-Yuan ; et al.	2019-05-16
Interconnect structure and method of forming the same Grant 10,290,538 - Chen , et al.	2019-05-14
Semiconductor device and method Grant 10,269,632 - Chu , et al.	2019-04-23
Systems and Methods for in SITU Maintenance of a Thin Hardmask During an Etch Process App 20190115225 - Ting; Chih-Yuan ; et al.	2019-04-18
Integrated Circuit with Conductive Line Having Line-Ends App 20190115250 - Ting; Chih-Yuan ; et al.	2019-04-18
Interconnect Structure and Method of Forming the Same App 20190067090 - Chen; Jeng-Shiou ; et al.	2019-02-28
Patterning approach for improved via landing profile Grant 10,170,420 - Ting , et al. J	2019-01-01
Integrated circuit with conductive line having line-ends Grant 10,163,689 - Ting , et al. Dec	2018-12-25
Systems and methods for in SITU maintenance of a thin hardmask during an etch process Grant 10,157,752 - Ting , et al. Dec	2018-12-18
Mitigating Pattern Collapse App 20180342418 - TING; Chih-Yuan ; et al.	2018-11-29
Interconnect structure and method of forming the same Grant 10,115,630 - Chen , et al. October 30, 2	2018-10-30
Contact Plug without Seam Hole and Methods of Forming the Same App 20180240704 - Ting; Chih-Yuan ; et al.	2018-08-23
Mitigating pattern collapse Grant 10,043,706 - Ting , et al. August 7, 2	2018-08-07
Semiconductor device having air gap structures and method of fabricating thereof Grant 10,043,754 - Ting , et al. August 7, 2	2018-08-07
Air Gap Structure and Method App 20180174961 - Ting; Chih-Yuan ; et al.	2018-06-21
Pattern Fidelity Enhancement with Directional Patterning Technology App 20180174853 - Shen; Yu-Tien ; et al.	2018-06-21
Interconnect Structure and Method of Forming the Same App 20180174886 - Chen; Jeng-Shiou ; et al.	2018-06-21
Via corner engineering in trench-first dual damascene process Grant 10,002,784 - Ting June 19, 2	2018-06-19
Air gap structure and method Grant 9,991,200 - Ting , et al. June 5, 2	2018-06-05
Contact plug without seam hole and methods of forming the same Grant 9,966,309 - Ting , et al. May 8, 2	2018-05-08
Semiconductor device having air gap structures and method of fabricating thereof Grant 9,929,094 - Ting , et al. March 27, 2	2018-03-27
Interconnect structure and method of forming the same Grant 9,892,960 - Chen , et al. February 13, 2	2018-02-13
Semiconductor interconnect structure and manufacturing method thereof Grant 9,818,643 - Ting November 14, 2	2017-11-14
Semiconductor Device and Method App 20170271205 - Chu; Ming-Hui ; et al.	2017-09-21
Semiconductor Interconnect Structure And Manufacturing Method Thereof App 20170250105 - TING; CHIH-YUAN	2017-08-31
Novel Patterning Approach For Improved Via Landing Profile App 20170229397 - Ting; Chih-Yuan ; et al.	2017-08-10
Method and Apparatus for Back End of Line Semiconductor Device Processing App 20170221816 - Wu; Chung-Wen ; et al.	2017-08-03
Via Corner Engineering in Trench-First Dual Damascene Process App 20170178951 - Ting; Chih-Yuan	2017-06-22
Semiconductor Device Having Air Gap Structures And Method Of Fabricating Thereof App 20170154847 - TING; Chih-Yuan ; et al.	2017-06-01
Semiconductor interconnect structure and manufacturing method thereof Grant 9,666,534 - Ting May 30, 2	2017-05-30
Interconnect Structure for Semiconductor Devices App 20170148735 - Ting; Chih-Yuan	2017-05-25
Method and apparatus for back end of line semiconductor device processing Grant 9,627,250 - Wu , et al. April 18, 2	2017-04-18
Integrated Circuit With Conductive Line Having Line-Ends App 20170098574 - Ting; Chih-Yuan ; et al.	2017-04-06
Method of forming pattern for semiconductor device Grant 9,601,344 - Lee , et al. March 21, 2	2017-03-21
Interconnect structure and method of forming same Grant 9,601,348 - Chu , et al. March 21, 2	2017-03-21
Method of Preventing Pattern Collapse App 20170069573 - Ting; Chih-Yuan ; et al.	2017-03-09
Semiconductor Device Having Air Gap Structures And Method Of Fabricating Thereof App 20170062348 - TING; Chih-Yuan ; et al.	2017-03-02
Via corner engineering in trench-first dual damascene process Grant 9,583,384 - Ting February 28, 2	2017-02-28
Semiconductor device having air gap structures and method of fabricating thereof Grant 9,570,341 - Ting , et al. February 14, 2	2017-02-14
Interconnect structure for semiconductor devices Grant 9,564,355 - Ting February 7, 2	2017-02-07
Contact Plug without Seam Hole and Methods of Forming the Same App 20170025309 - Ting; Chih-Yuan ; et al.	2017-01-26
Method of forming integrated circuit with conductive line having line-ends Grant 9,524,902 - Huang , et al. December 20, 2	2016-12-20
Interconnect Structure And Method Of Forming The Same App 20160343611 - Chen; Jeng-Shiou ; et al.	2016-11-24
Method of preventing pattern collapse Grant 9,502,287 - Ting , et al. November 22, 2	2016-11-22
Via Corner Engineering in Trench-First Dual Damascene Process App 20160336221 - Ting; Chih-Yuan	2016-11-17
Semiconductor device having air gap structures and method of fabricating thereof Grant 9,496,224 - Ting , et al. November 15, 2	2016-11-15
Interconnect Structure and Method of Forming the Same App 20160329237 - Chen; Jeng-Shiou ; et al.	2016-11-10
Contact plug without seam hole and methods of forming the same Grant 9,472,448 - Ting , et al. October 18, 2	2016-10-18
Patterning approach to reduce via to via minimum spacing Grant 9,437,541 - Ting , et al. September 6, 2	2016-09-06
Interconnect structure and method of forming the same Grant 9,412,650 - Chen , et al. August 9, 2	2016-08-09
Via corner engineering in trench-first dual damascene process Grant 9,406,589 - Ting August 2, 2	2016-08-02
Novel Patterning Approach For Improved Via Landing Profile App 20160218038 - Ting; Chih-Yuan ; et al.	2016-07-28
Interconnect structure and method of forming the same Grant 9,401,329 - Chen , et al. July 26, 2	2016-07-26
Interconnect structure and method of forming the same Grant 9,397,047 - Chen , et al. July 19, 2	2016-07-19
Systems and Methods for In SITU Maintenance of a Thin Hardmask During an Etch Process App 20160155648 - Ting; Chih-Yuan ; et al.	2016-06-02
Patterning approach for improved via landing profile Grant 9,312,222 - Ting , et al. April 12, 2	2016-04-12
Air Gap Structure and Method App 20160093566 - Ting; Chih-Yuan ; et al.	2016-03-31
Semiconductor device interconnection structure having dielectric-filled notches Grant 9,287,212 - Ting , et al. March 15, 2	2016-03-15
Systems and methods for in situ maintenance of a thin hardmask during an etch process Grant 9,257,298 - Ting , et al. February 9, 2	2016-02-09
Method Of Preventing Pattern Collapse App 20160027688 - Ting; Chih-Yuan ; et al.	2016-01-28
Interconnect Structure and Method of Forming the Same App 20150371955 - Chen; Jeng-Shiou ; et al.	2015-12-24
Semiconductor Device Having Air Gap Structures And Method Of Fabricating Thereof App 20150332954 - Ting; Chih-Yuan ; et al.	2015-11-19
Semiconductor Device Having Air Gap Structures And Method Of Fabricating Thereof App 20150333011 - Ting; Chih-Yuan ; et al.	2015-11-19
Semiconductor Interconnect Structure And Manufacturing Method Thereof App 20150332999 - TING; CHIH-YUAN	2015-11-19
Interconnection Structure And Method For Semiconductor Device App 20150311152 - Ting; Chih-Yuan ; et al.	2015-10-29
Method of preventing a pattern collapse Grant 9,153,479 - Ting , et al. October 6, 2	2015-10-06
Systems and Methods for In Situ Maintenance of a Thin Hardmask During an Etch Process App 20150279685 - Ting; Chih-Yuan ; et al.	2015-10-01
Interconnect structure and method of forming the same Grant 9,142,450 - Chen , et al. September 22, 2	2015-09-22
Patterning Approach to Reduce Via to Via Minimum Spacing App 20150262934 - Ting; Chih-Yuan ; et al.	2015-09-17
Semiconductor Device and Method App 20150262873 - Chu; Ming-Hui ; et al.	2015-09-17
Contact Plug without Seam Hole and Methods of Forming the Same App 20150262868 - Ting; Chih-Yuan ; et al.	2015-09-17
Via Corner Engineering in Trench-First Dual Damascene Process App 20150262912 - Ting; Chih-Yuan	2015-09-17
Method of forming interconnection structure having notches for semiconductor device Grant 9,076,729 - Ting , et al. July 7, 2	2015-07-07
Method Of Forming Pattern For Semiconductor Device App 20150187591 - Lee; Chia-Ying ; et al.	2015-07-02
Method of Semiconductor Integrated Circuit Fabrication App 20150170959 - Huang; Pei-Wen ; et al.	2015-06-18
Interconnect Structure for Semiconductor Devices App 20150162262 - Ting; Chih-Yuan	2015-06-11
Patterning approach to reduce via to via minimum spacing Grant 9,048,299 - Ting , et al. June 2, 2	2015-06-02
Fin Field Effect Transistor And Method Of Forming The Same App 20150137265 - HSU; Ju-Wang ; et al.	2015-05-21
Method of forming pattern for semiconductor device Grant 8,962,484 - Lee , et al. February 24, 2	2015-02-24
Cleaning solution comprising an ether acetate for preventing pattern collapse Grant 8,957,006 - Ting , et al. February 17, 2	2015-02-17
Fin field effect transistor and method of forming the same Grant 8,927,353 - Hsu , et al. January 6, 2	2015-01-06
Interconnection Structure And Method For Semiconductor Device App 20140264873 - Ting; Chih-Yuan ; et al.	2014-09-18
Patterning Approach to Reduce Via to Via Minimum Spacing App 20140264932 - Ting; Chih-Yuan ; et al.	2014-09-18
Method and Apparatus for Back End of Line Semiconductor Device Processing App 20140264926 - Wu; Chung-Wen ; et al.	2014-09-18
Interconnect Structure And Method Of Forming The Same App 20140264903 - Chen; Jeng-Shiou ; et al.	2014-09-18
Novel Patterning Approach for Improved Via Landing Profile App 20140264902 - Ting; Chih-Yuan ; et al.	2014-09-18
Interconnect Structure And Method Of Forming The Same App 20140252648 - Chen; Jeng-Shiou ; et al.	2014-09-11
Method of Preventing a Pattern Collapse App 20140252625 - Ting; Chih-Yuan ; et al.	2014-09-11
Interconnect Structure And Method Of Forming The Same App 20140252636 - Chen; Jeng-Shiou ; et al.	2014-09-11
Cleaning Solution for Preventing Pattern Collapse App 20140256155 - Ting; Chih-Yuan ; et al.	2014-09-11
Mitigating Pattern Collapse App 20140203445 - Ting; Chih-Yuan ; et al.	2014-07-24
Method of patterning for a semiconductor device Grant 8,697,537 - Lee , et al. April 15, 2	2014-04-15
Method Of Patterning For A Semiconductor Device App 20130196481 - Lee; Chia Ying ; et al.	2013-08-01
Method Of Forming Pattern For Semiconductor Device App 20130157462 - Lee; Chia Ying ; et al.	2013-06-20
Wet cleaning stripping of etch residue after trench and via opening formation in dual damascene process Grant 7,968,506 - Chou , et al. June 28, 2	2011-06-28
Wet Cleaning Stripping Of Etch Residue After Trench And Via Opening Formation In Dual Damascene Process App 20100055897 - Chou; Chun-Li ; et al.	2010-03-04
Fin Filled Effect Transistor And Method Of Forming The Same App 20080277745 - Hsu; Ju-Wang ; et al.	2008-11-13
Process for preparing low-dielectric-constant silica film App 20030185975 - Wan, Ben-Zu ; et al.	2003-10-02