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name:-0.010384082794189
name:-0.0060489177703857
name:-0.0047760009765625
Tindel; Steven Trey Patent Filings

Tindel; Steven Trey

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tindel; Steven Trey.The latest application filed is for "detecting and correcting substrate process drift using machine learning".

Company Profile
4.3.9
  • Tindel; Steven Trey - Austin TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Detecting And Correcting Substrate Process Drift Using Machine Learning
App 20220066411 - Ummethala; Upendra V. ;   et al.
2022-03-03
Substrate Flipping Device
App 20220033197 - Phan; Michael Minh ;   et al.
2022-02-03
Substrate Measurement Subsystem
App 20220028716 - Ummethala; Upendra V. ;   et al.
2022-01-27
Integrated Substrate Measurement System To Improve Manufacturing Process Performance
App 20220028713 - Ummethala; Upendra V. ;   et al.
2022-01-27
Determining Substrate Profile Properties Using Machine Learning
App 20220026817 - Ummethala; Upendra V. ;   et al.
2022-01-27
System and method for electrostatically chucking a substrate to a carrier
Grant 11,196,360 - Lerner , et al. December 7, 2
2021-12-07
Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
Grant 11,183,411 - Vellore , et al. November 23, 2
2021-11-23
Method Of Pre Aligning Carrier, Wafer And Carrier-wafer Combination For Throughput Efficiency
App 20210159106 - VELLORE; Kim Ramkumar ;   et al.
2021-05-27
Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
Grant 10,916,464 - Vellore , et al. February 9, 2
2021-02-09
System and method for electrostatically chucking a substrate to a carrier
App 20210028726 - LERNER; Alexander N. ;   et al.
2021-01-28
Carrier Foup And A Method Of Placing A Carrier
App 20210028039 - TINDEL; Steven Trey ;   et al.
2021-01-28
Method Of Pre Aligning Carrier, Wafer And Carrier-wafer Combination For Throughput Efficiency
App 20210028044 - VELLORE; Kim Ramkumar ;   et al.
2021-01-28

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