Timmerman; John
Patent Applications and Registrations
Patent applications and USPTO patent grants for Timmerman; John.The latest application filed is for "thermal interface materials".
- Timmerman; John - Minneapolis MN
| Patent | Date |
|---|---|
| Thermal interface material with mixed aspect ratio particle dispersions Grant 11,447,677 - Timmerman , et al. September 20, 2 | 2022-09-20 |
| Thermal Interface Materials App 20210388203 - Wu; Chunyong ; et al. | 2021-12-16 |
| Thermal Interface Material with Mixed Aspect Ratio Particle Dispersions App 20190322918 - TIMMERMAN; John ; et al. | 2019-10-24 |
| Thermally conductive EMI suppression compositions Grant 9,999,158 - Misra , et al. June 12, 2 | 2018-06-12 |
| Thermally conductive dielectric interface Grant 9,693,481 - Timmerman , et al. June 27, 2 | 2017-06-27 |
| Thermal Interface Material with Mixed Aspect Ratio Particle Dispersions App 20170158936 - TIMMERMAN; JOHN ; et al. | 2017-06-08 |
| Thermal interface material with mixed aspect ratio particle dispersions Grant 9,611,414 - Timmerman , et al. April 4, 2 | 2017-04-04 |
| Thermal Interface Material with Mixed Aspect Ratio Particle Dispersions App 20160009975 - Timmerman; John ; et al. | 2016-01-14 |
| Thermally Conductive Dielectric Interface App 20140374071 - Timmerman; John ; et al. | 2014-12-25 |
| Thermally Conductive EMI Suppression Compositions App 20140182924 - Misra; Sanjay ; et al. | 2014-07-03 |
| Dual Cure Thermally Conductive Adhesive App 20130042972 - Timmerman; John ; et al. | 2013-02-21 |
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