Tilly; William J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tilly; William J..The latest application filed is for "methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps".
- Tilly; William J. - Poughkeepsie NY
| Patent | Date |
|---|---|
| Methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps Grant 5,277,749 - Griffith , et al. January 11, 1 | 1994-01-11 |
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