Tietz; James V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tietz; James V..The latest application filed is for "methods for verifying gas flow rates from a gas supply system into a plasma processing chamber".

Company Profile

0.23.10

Tietz; James V. - Fremont CA
Tietz, James V. - Freemont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods for verifying gas flow rates from a gas supply system into a plasma processing chamber Grant 9,234,775 - Larson , et al. January 12, 2	2016-01-12
Methods For Verifying Gas Flow Rates From A Gas Supply System Into A Plasma Processing Chamber App 20140033828 - Larson; Dean J. ; et al.	2014-02-06
Apparatus for delivering a process gas Grant 8,521,461 - Shareef , et al. August 27, 2	2013-08-27
Apparatus For Delivering A Process Gas App 20120247581 - Shareef; Iqbal A. ; et al.	2012-10-04
Methods for delivering a process gas Grant 8,150,646 - Shareef , et al. April 3, 2	2012-04-03
Methods For Delivering A Process Gas App 20110029268 - Shareef; Iqbal A. ; et al.	2011-02-03
Methods for performing transient flow prediction and verification using discharge coefficients Grant 7,881,886 - Shareef , et al. February 1, 2	2011-02-01
Methods for performing actual flow verification Grant 7,822,570 - Shareef , et al. October 26, 2	2010-10-26
Methods For Performing Actual Flow Verification App 20080115560 - Shareef; Iqbal A. ; et al.	2008-05-22
Method of plasma etching low-k dielectric materials Grant 7,311,852 - Li , et al. December 25, 2	2007-12-25
Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition Grant 7,294,580 - Yun , et al. November 13, 2	2007-11-13
Methods for verifying gas flow rates from a gas supply system into a plasma processing chamber App 20070021935 - Larson; Dean J. ; et al.	2007-01-25
Plasma etching of silicon carbide Grant 7,166,535 - Li , et al. January 23, 2	2007-01-23
Article for polishing semiconductor substrates Grant 7,014,538 - Tietz , et al. March 21, 2	2006-03-21
Method for plasma etching using periodic modulation of gas chemistry Grant 6,916,746 - Hudson , et al. July 12, 2	2005-07-12
Method for plasma etching using periodic modulation of gas chemistry App 20050136682 - Hudson, Eric A. ; et al.	2005-06-23
Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition App 20040224520 - Yun, Seokmin ; et al.	2004-11-11
Fixed abrasive articles App 20040082288 - Tietz, James V. ; et al.	2004-04-29
Method of plasma etching low-k dielectric materials App 20030024902 - Li, Si Yi ; et al.	2003-02-06
Fixed abrasive articles App 20020077037 - Tietz, James V.	2002-06-20
Chemical mechanical polishing with a polishing sheet and a support sheet Grant 6,302,767 - Tietz October 16, 2	2001-10-16
Apparatus and method for grinding a semiconductor wafer surface Grant 6,273,794 - Tietz , et al. August 14, 2	2001-08-14
Magnetically-levitated rotor system for an RTP chamber Grant 6,157,106 - Tietz , et al. December 5, 2	2000-12-05
Chemical mechanical polishing with a polishing sheet and a support sheet Grant 6,135,859 - Tietz October 24, 2	2000-10-24
Method and apparatus for achieving temperature uniformity of a substrate Grant 6,123,766 - Williams , et al. September 26, 2	2000-09-26
Multi-zone gas flow control in a process chamber Grant 6,090,210 - Ballance , et al. July 18, 2	2000-07-18
Reflector cover for a semiconductor processing chamber Grant 6,035,100 - Bierman , et al. March 7, 2	2000-03-07
Method and apparatus for purging the back side of a substrate during chemical vapor processing Grant 5,960,555 - Deaton , et al. October 5, 1	1999-10-05
Method and apparatus for purging the back side of a substrate during chemical vapor processing Grant 5,884,412 - Tietz , et al. March 23, 1	1999-03-23
Lift pin and support pin apparatus for a processing chamber Grant 5,879,128 - Tietz , et al. March 9, 1	1999-03-09
Semiconductor wafer support with graded thermal mass Grant 5,848,889 - Tietz , et al. December 15, 1	1998-12-15
Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween Grant 5,781,693 - Ballance , et al. July 14, 1	1998-07-14

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