Tien; Hsing Kuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tien; Hsing Kuo.The latest application filed is for "package substrate, electronic device package and method for manufacturing the same".

Company Profile

1.8.12

Tien; Hsing Kuo - Kaohsiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package substrate Grant 11,432,406 - Hsu , et al. August 30, 2	2022-08-30
Package Substrate, Electronic Device Package And Method For Manufacturing The Same App 20220157745 - HSU; Wu Chou ; et al.	2022-05-19
Package substrate, electronic device package and method for manufacturing the same Grant 11,335,650 - Hsu , et al. May 17, 2	2022-05-17
Package Substrate And Method For Manufacturing The Same App 20220095462 - HSU; Wu Chou ; et al.	2022-03-24
Package substrate, electronic device package and method for manufacturing the same Grant 11,239,184 - Hsu , et al. February 1, 2	2022-02-01
Semiconductor Device Package And Method For Manufacturing The Same App 20220028801 - TIEN; Hsing Kuo ; et al.	2022-01-27
Package Substrate, Electronic Device Package And Method For Manufacturing The Same App 20210391283 - HSU; Wu Chou ; et al.	2021-12-16
Package Substrate, Electronic Device Package And Method For Manufacturing The Same App 20210391284 - HSU; Wu Chou ; et al.	2021-12-16
Embedded Component Package Structure And Manufacturing Method Thereof App 20210343648 - TIEN; Hsing Kuo ; et al.	2021-11-04
Semiconductor Device Package And Method For Manufacturing The Same App 20210280565 - HUANG; Chien-Mei ; et al.	2021-09-09
Embedded component package structure and manufacturing method thereof Grant 11,062,996 - Tien , et al. July 13, 2	2021-07-13
Semiconductor device package with stress buffering layer and method for manufacturing the same Grant 11,018,120 - Huang , et al. May 25, 2	2021-05-25
Semiconductor Device Package And Method Of Manufacturing The Same App 20210035912 - TIEN; Hsing Kuo ; et al.	2021-02-04
Semiconductor Device Package And Method For Manufacturing The Same App 20200388600 - HUANG; Chien-Mei ; et al.	2020-12-10
Embedded component package structure and method of manufacturing the same Grant 10,276,507 - Lee , et al.	2019-04-30
Semiconductor Device And Method Of Manufacturing The Same App 20180166370 - LIN; Chai-Chi ; et al.	2018-06-14
Semiconductor device and method of manufacturing the same Grant 9,997,442 - Lin , et al. June 12, 2	2018-06-12
Embedded component package structure and method of manufacturing the same Grant 9,887,167 - Lee , et al. February 6, 2	2018-02-06
Embedded Component Package Structure And Method Of Manufacturing The Same App 20170301626 - LEE; Chih-Cheng ; et al.	2017-10-19
Embedded Component Package Structure And Method Of Manufacturing The Same App 20160064329 - LEE; Chih-Cheng ; et al.	2016-03-03

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