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Patent applications and USPTO patent grants for Tien; Feng-Jung.The latest application filed is for "insulation film of a signal transmission line and signal transmission line comprising the same".
Patent | Date |
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Insulation Film Of A Signal Transmission Line And Signal Transmission Line Comprising The Same App 20160088728 - Wang; Fu-Min ;   et al. | 2016-03-24 |
Cover Layer With High Thermal Resistance And High Reflectivity For A Printed Circuit Board App 20150257296 - Hung; Tzu-Ching ;   et al. | 2015-09-10 |
Low thermal-impedance insulated metal substrate and method for manufacturing the same Grant 8,415,004 - Lee , et al. April 9, 2 | 2013-04-09 |
Low Thermal-impedance Insulated Metal Substrate And Method For Maufacturing The Same App 20110111191 - Lee; Yu-Hsien ;   et al. | 2011-05-12 |
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