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Patent applications and USPTO patent grants for Tien; Candy.The latest application filed is for "cavity-down ball grid array package with semiconductor chip solder ball".
Patent | Date |
---|---|
Cavity-down ball grid array package with semiconductor chip solder ball Grant 6,650,015 - Chen , et al. November 18, 2 | 2003-11-18 |
Cavity-down ball grid array package with semiconductor chip solder ball App 20030146508 - Chen, Eing-Chieh ;   et al. | 2003-08-07 |
Semiconductor package having an exposed heat spreader Grant 6,552,428 - Huang , et al. April 22, 2 | 2003-04-22 |
Semiconductor package having a heat sink with an exposed surface Grant 6,246,115 - Tang , et al. June 12, 2 | 2001-06-12 |
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