Tian Wenjun

USPTO Trademark & Patent Filings

Tian Wenjun

Trademark applications and grants for Tian Wenjun. Tian Wenjun has 1 trademark applications. The latest application filed is for "APIESDORENG"

Company Profile
    Company Aliases
  • Tian Wenjun
  • wenjun tian
  • Tian; Wenjun - Kunshan City CN
  • Tian; Wenjun - Jiangsu Province CN
  • TIAN; Wenjun - Kunshan City CN
  • Tian; Wenjun - Kunshan CN
Entity Type INDIVIDUAL
Address No.37, community 14, Xingguang village ganjun Town, Ganzhou District Zhangye City, Gansu CHINA 734019

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks Patents
Patent Applications
Patent ApplicationDate
RESIN COMPOSITION, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
20180072884 - 15/813165 WANG; Rongtao ;   et al.
2018-03-15
RESIN COMPOSITION, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
20160222204 - 14/411166 WANG; Rongtao ;   et al.
2016-08-04
POLYPHENYLENE OXIDE RESIN, METHOD OF PREPARING POLYPHENYLENE OXIDE RESIN, POLYPHENYLENE OXIDE PREPOLYMER AND RESIN COMPOSITION
20160185904 - 14/643627 GAO; Yu ;   et al.
2016-06-30
AROMATIC TETRAFUNCTIONAL VINYLBENZYL RESIN COMPOSITION AND USE THEREOF
20160160008 - 14/731008 WANG; Rongtao ;   et al.
2016-06-09
LOW DISSIPATION FACTOR RESIN COMPOSITION AND PRODUCT MADE THEREBY
20160122521 - 14/730956 WANG; Rongtao ;   et al.
2016-05-05
Resin composition, copper clad laminate and printed circuit board using same
10,072,148 - 15/813,165 Wang , et al. September 11, 2
2018-09-11
Resin composition, copper clad laminate and printed circuit board using same
9,850,375 - 14/411,166 Wang , et al. December 26, 2
2017-12-26
Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same
9,650,512 - 13/964,070 Wang , et al. May 16, 2
2017-05-16
Aromatic tetrafunctional vinylbenzyl resin composition and use thereof
9,574,070 - 14/731,008 Wang , et al. February 21, 2
2017-02-21
Low dissipation factor resin composition and product made thereby
9,469,757 - 14/730,956 Wang , et al. October 18, 2
2016-10-18
Patent Grants & Applications
Trademark Applications
Mark Image

Registration | Serial
Trademark
Application Date
 APIESDORENG
"APIESDORENG"
90416067
APIESDORENG
2020-12-27
Company Registrations
SEC0001492281Tian Wenjun

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