Tian; Shurong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tian; Shurong.The latest application filed is for "spacer to reduce magnetic coupling".

Company Profile

15.35.37

Tian; Shurong - Mount Kisco NY
Tian; Shurong - Armonk NY
Tian; Shurong - Yorktown Heights NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-device cooling structure having assembly alignment features Grant 11,439,043 - Tian , et al. September 6, 2	2022-09-06
Flexible cold plate with parallel fluid flow paths Grant 11,350,544 - Tian , et al. May 31, 2	2022-05-31
Spacer To Reduce Magnetic Coupling App 20220165488 - Yao; Yuan ; et al.	2022-05-26
Injection-molded flexible cold plate Grant 11,243,034 - Takken , et al. February 8, 2	2022-02-08
Flexible Cold Plate With Parallel Fluid Flow Paths App 20210307195 - Tian; Shurong ; et al.	2021-09-30
Burst resistant thin wall heat sink Grant 11,131,506 - Coteus , et al. September 28, 2	2021-09-28
Flex Prevention Mechanical Structure Such as a Ring for Large Integrated Circuit Modules and Packages and Methods of Manufacture Using Same App 20210217690 - Tian; Shurong ; et al.	2021-07-15
Combined inductor and heat transfer device Grant 11,056,413 - Zhang , et al. July 6, 2	2021-07-06
Cold plate with flex regions between fin areas Grant 11,058,030 - Tian , et al. July 6, 2	2021-07-06
Backing Plate With Manufactured Features On Top Surface App 20210193557 - Yao; Yuan ; et al.	2021-06-24
Combined Inductor And Heat Transfer Device App 20200373217 - Zhang; Xin ; et al.	2020-11-26
Multi-device Cooling Structure Having Assembly Alignment Features App 20200375066 - Tian; Shurong ; et al.	2020-11-26
Injection-molded Flexible Cold Plate App 20200340762 - Takken; Todd E. ; et al.	2020-10-29
Cold Plate With Flex Regions Between Fin Areas App 20200337181 - Tian; Shurong ; et al.	2020-10-22
Space-efficient pressure relief mechanism for immersion cooling of computing elements Grant 10,779,436 - Tian , et al. Sept	2020-09-15
High-density, fail-in-place switches for computer and data networks Grant 10,749,817 - Coteus , et al. A	2020-08-18
Injection-molded flexible cold plate Grant 10,712,102 - Takken , et al.	2020-07-14
Mechanically Flexible Cold Plates For Low Power Components App 20200221610 - Coteus; Paul W. ; et al.	2020-07-09
Mechanically flexible cold plates for low power components Grant 10,631,438 - Coteus , et al.	2020-04-21
Space-efficient pressure relief mechanism for immersion cooling of computing elements Grant 10,568,236 - Tian , et al. Feb	2020-02-18
Space-efficient Pressure Relief Mechanism For Immersion Cooling Of Computing Elements App 20200037469 - Tian; Shurong ; et al.	2020-01-30
Fans in series with cable plug interfaces Grant 10,531,598 - Coteus , et al. J	2020-01-07
High-density, fail-in-place switches for computer and data networks Grant 10,389,654 - Coteus , et al. A	2019-08-20
Injection-molded Flexible Cold Plate App 20190204023 - Takken; Todd E. ; et al.	2019-07-04
Space-efficient Pressure Relief Mechanism For Immersion Cooling Of Computing Elements App 20190200483 - Tian; Shurong ; et al.	2019-06-27
Mechanically Flexible Cold Plates For Low Power Components App 20190200485 - Coteus; Paul W. ; et al.	2019-06-27
Fans in Series with Cable Plug Interfaces App 20190200487 - Coteus; Paul W. ; et al.	2019-06-27
Burst Resistant Thin Wall Heat Sink App 20190154340 - Coteus; Paul W. ; et al.	2019-05-23
Cold plate Grant 10,231,356 - Marroquin , et al.	2019-03-12
Burst resistant thin wall heat sink Grant 10,222,125 - Coteus , et al.	2019-03-05
Flexible cold plate with enhanced flexibility Grant 10,215,504 - Coteus , et al. Feb	2019-02-26
High-density, Fail-in-place Switches For Computer And Data Networks App 20190020597 - Coteus; Paul W. ; et al.	2019-01-17
Cold Plate App 20180124949 - MARROQUIN; Christopher M. ; et al.	2018-05-03
Near-chip compliant layer for reducing perimeter stress during assembly process Grant 9,922,900 - Schultz , et al. March 20, 2	2018-03-20
Cold plate Grant 9,894,801 - Marroquin , et al. February 13, 2	2018-02-13
Power converter using near-load output capacitance, direct inductor contact, and/or remote current sense Grant 9,831,783 - Coteus , et al. November 28, 2	2017-11-28
Power Converter Using Near-load Output Capacitance, Direct Inductor Contact, And/or Remote Current Sense App 20170194871 - Coteus; Paul W. ; et al.	2017-07-06
Near-chip Compliant Layer For Reducing Perimeter Stress During Assembly Process App 20170170092 - Schultz; Mark D. ; et al.	2017-06-15
Thermal management of optical coupling systems Grant 9,678,289 - Schultz , et al. June 13, 2	2017-06-13
Thermal Management Of Optical Coupling Systems App 20170160501 - Schultz; Mark D. ; et al.	2017-06-08
High-density, Fail-in-place Switches For Computer And Data Networks App 20170155598 - Coteus; Paul W. ; et al.	2017-06-01
High-density, fail-in-place switches for computer and data networks Grant 9,634,959 - Coteus , et al. April 25, 2	2017-04-25
Near-chip compliant layer for reducing perimeter stress during assembly process Grant 9,570,373 - Schultz , et al. February 14, 2	2017-02-14
Burst Resistant Thin Wall Heat Sink App 20160290727 - Coteus; Paul W. ; et al.	2016-10-06
Flexible Cold Plate With Enhanced Flexibility App 20160290728 - Coteus; Paul W. ; et al.	2016-10-06
Cooling system for electronic components Grant 9,342,121 - Anderl , et al. May 17, 2	2016-05-17
Cooling system for electronic components Grant 9,213,378 - Anderl , et al. December 15, 2	2015-12-15
High-density, Fail-in-place Switches For Computer And Data Networks App 20150289406 - Coteus; Paul W. ; et al.	2015-10-08
Thermal Interface Solution With Reduced Adhesion Force App 20150092352 - Chainer; Timothy J. ; et al.	2015-04-02
Efficiency of static core turn-off in a system-on-a-chip with variation Grant 8,571,847 - Cher , et al. October 29, 2	2013-10-29
Reliability and performance of a system-on-a-chip by predictive wear-out based activation of functional components Grant 8,549,363 - Cher , et al. October 1, 2	2013-10-01
Cooling System for Electronic Components App 20130176679 - Anderl; William James ; et al.	2013-07-11
Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages Grant 8,081,473 - Cipolla , et al. December 20, 2	2011-12-20
Method and apparatus of water cooling several parallel circuit cards each containing several chip packages Grant 8,004,841 - Cipolla , et al. August 23, 2	2011-08-23
Efficiency Of Static Core Turn-off In A System-on-a-chip With Variation App 20110172984 - Cher; Chen-Yong ; et al.	2011-07-14
Reliability And Performance Of A System-on-a-chip By Predictive Wear-out Based Activation Of Functional Components App 20110173432 - Cher; Chen-Yong ; et al.	2011-07-14
Cooling System for Electronic Components App 20100254089 - Anderl; William James ; et al.	2010-10-07
Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs) Grant 7,715,197 - Tian , et al. May 11, 2	2010-05-11
Apparatus And Method Of Direct Water Cooling Several Parallel Circuit Cards Each Containing Several Chip Packages App 20100025010 - Cipolla; Thomas M. ; et al.	2010-02-04
COINED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES SUCH AS DUAL IN-LINE MEMORY MODULES (DIMMs) App 20090303681 - Tian; Shurong ; et al.	2009-12-10
Method And Apparatus Of Water Cooling Several Parallel Circuit Cards Each Containing Several Chip Packages App 20090277616 - Cipolla; Thomas M. ; et al.	2009-11-12
Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling Grant 7,486,513 - Hall , et al. February 3, 2	2009-02-03
Folded-sheet-metal heatsinks for closely packaged heat-producing devices Grant 7,474,529 - Tian , et al. January 6, 2	2009-01-06
Method And Apparatus For Cooling An Equipment Enclosure Through Closed-loop Liquid-assisted Air Cooling In Combination With Direct Liquid Cooling App 20080212282 - Hall; Shawn A. ; et al.	2008-09-04
Folded-sheet-metal Heatsinks For Closely Packaged Heat-producing Devices App 20080123300 - Tian; Shurong ; et al.	2008-05-29
Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling Grant 7,342,789 - Hall , et al. March 11, 2	2008-03-11
Method And Apparatus For Cooling An Equipment Enclosure Through Closed-loop Liquid-assisted Air Cooling In Combination With Direct Liquid Cooling App 20080055851 - Hall; Shawn A. ; et al.	2008-03-06
Method And Apparatus For Cooling An Equipment Enclosure Through Closed-loop Liquid-assisted Air Cooling In Combination With Direct Liquid Cooling App 20080055856 - Hall; Shawn A. ; et al.	2008-03-06
Method And Apparatus For Cooling An Equipment Enclosure Through Closed-loop, Liquid-assisted Air Cooling In Combination With Direct Liquid Cooling App 20070002536 - Hall; Shawn A. ; et al.	2007-01-04

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