Tian; Edmund Lua Koon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tian; Edmund Lua Koon.The latest application filed is for "stacked microelectronic devices and methods for manufacturing stacked microelectronic devices".
- Tian; Edmund Lua Koon - Singapore SG
| Patent | Date |
|---|---|
| Stacked Microelectronic Devices And Methods For Manufacturing Stacked Microelectronic Devices App 20120108010 - Tian; Edmund Lua Koon ; et al. | 2012-05-03 |
| Methods for assembling semiconductor devices and interposers Grant 7,528,007 - Fee , et al. May 5, 2 | 2009-05-05 |
| Die package Grant 7,489,028 - Tian , et al. February 10, 2 | 2009-02-10 |
| Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers Grant 7,274,095 - Fee , et al. September 25, 2 | 2007-09-25 |
| Methods for assembling semiconductor devices and interposers App 20060194373 - Fee; Setho Sing ; et al. | 2006-08-31 |
| Die package App 20050253226 - Tian, Edmund Lua Koon ; et al. | 2005-11-17 |
| Die package Grant 6,919,645 - Tian , et al. July 19, 2 | 2005-07-19 |
| Die package Grant 6,825,572 - Tian , et al. November 30, 2 | 2004-11-30 |
| Ball grid array interposer, packages and methods App 20040217459 - Fee, Setho Sing ; et al. | 2004-11-04 |
| Ball grid array interposer, packages and methods Grant 6,746,894 - Fee , et al. June 8, 2 | 2004-06-08 |
| Die package App 20030107138 - Tian, Edmund Lua Koon ; et al. | 2003-06-12 |
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