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Patent applications and USPTO patent grants for Thorum; Matthew S..The latest application filed is for "residue removal".
Patent | Date |
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Residue Removal App 20210305039 - Thorum; Matthew S. | 2021-09-30 |
Freezing A Sacrificial Material In Forming A Semiconductor App 20210225637 - Thorum; Matthew S. | 2021-07-22 |
Sublimation In Forming A Semiconductor App 20210210341 - Thorum; Matthew S. | 2021-07-08 |
Using Sacrificial Solids In Semiconductor Processing App 20210183643 - Thorum; Matthew S. ;   et al. | 2021-06-17 |
Gas residue removal Grant 11,037,779 - Thorum June 15, 2 | 2021-06-15 |
Removing a sacrificial material via sublimation in forming a semiconductor Grant 10,964,525 - Thorum March 30, 2 | 2021-03-30 |
Freezing a sacrificial material in forming a semiconductor Grant 10,957,530 - Thorum March 23, 2 | 2021-03-23 |
Using sacrificial solids in semiconductor processing Grant 10,937,644 - Thorum , et al. March 2, 2 | 2021-03-02 |
Hydrosilylation in semiconductor processing Grant 10,825,686 - Thorum , et al. November 3, 2 | 2020-11-03 |
Using sacrificial solids in semiconductor processing Grant 10,784,101 - Thorum , et al. Sept | 2020-09-22 |
Hydrosilylation In Semiconductor Processing App 20200075340 - Thorum; Matthew S. ;   et al. | 2020-03-05 |
Hydrosilylation in semiconductor processing Grant 10,475,656 - Thorum , et al. Nov | 2019-11-12 |
Using Sacrificial Solids In Semiconductor Processing App 20190333756 - Thorum; Matthew S. ;   et al. | 2019-10-31 |
Residue Removal App 20190189425 - Thorum; Matthew S. | 2019-06-20 |
Hydrosilylation In Semiconductor Processing App 20190189455 - Thorum; Matthew S. ;   et al. | 2019-06-20 |
Freezing A Sacrificial Material In Forming A Semiconductor App 20190189427 - Thorum; Matthew S. | 2019-06-20 |
Sublimation In Forming A Semiconductor App 20190189426 - Thorum; Matthew S. | 2019-06-20 |
Using Sacrificial Solids In Semiconductor Processing App 20190189424 - Thorum; Matthew S. ;   et al. | 2019-06-20 |
Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias Grant 9,617,648 - Thorum , et al. April 11, 2 | 2017-04-11 |
Pretreatment Of Nickel And Cobalt Liners For Electrodeposition Of Copper Into Through Silicon Vias App 20160258078 - Thorum; Matthew S. ;   et al. | 2016-09-08 |
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